MTFC32GAKAENA-4M IT
| Part Description |
IC FLASH 256GBIT MMC 100TBGA |
|---|---|
| Quantity | 498 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 100-TBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC32GAKAENA-4M IT – IC FLASH 256GBIT MMC 100TBGA
The MTFC32GAKAENA-4M IT is a 256 Gbit non-volatile FLASH memory device using NAND technology and an MMC memory interface. Packaged in a 100-TBGA (14 × 18 mm) footprint and offered in Micron's e•MMC™ series, it provides high-density embedded storage in a compact package.
This device is suited for designs that require MMC-based flash storage with defined operating temperature support and a specified memory organization.
Key Features
- Memory Type & Technology Non-volatile FLASH using NAND technology as specified in the product data.
- Capacity & Organization 256 Gbit total capacity with a 32G × 8 memory organization.
- Interface MMC memory interface for embedded storage integration.
- Package 100-TBGA package case (14 × 18 mm) for compact board-level implementation.
- Operating Temperature Specified ambient operating range of −40°C to 85°C (TA).
- Product Series & Manufacturer Part of the e•MMC™ series from Micron Technology Inc.
Typical Applications
- Embedded storage systems — Applications requiring a 256 Gbit NAND FLASH device with an MMC interface and compact 100-TBGA packaging.
- Firmware and data retention — Use where non-volatile MMC flash memory is needed to store system firmware or persistent data within the specified operating temperature range.
- Space-constrained designs — Board-level implementations that benefit from a high-density FLASH device in a 14 × 18 mm TBGA package.
Unique Advantages
- High-density storage: 256 Gbit capacity enables substantial on-board data or firmware storage within a single package.
- Defined memory organization: 32G × 8 organization provides a clear mapping for memory allocation and system integration.
- Compact package footprint: 100-TBGA (14 × 18 mm) supports space-efficient PCB layouts.
- Wide operating temperature: −40°C to 85°C ambient range accommodates a broad set of environmental conditions.
- MMC interface compatibility: Designed to integrate where MMC-based flash memory connectivity is required.
Why Choose IC FLASH 256GBIT MMC 100TBGA?
The MTFC32GAKAENA-4M IT positions itself as a high-density, MMC-interface FLASH-NAND memory component that combines substantial capacity with a compact 100-TBGA package and an extended operating temperature range. Its explicit memory organization and e•MMC™ series designation make it straightforward to evaluate for embedded storage requirements.
This part is suitable for designers and procurement teams seeking a 256 Gbit non-volatile memory solution with a defined package size and operating range, offering clear integration parameters for system-level implementation and long-term design planning.
Request a quote or contact sales to discuss availability, pricing, and technical details for MTFC32GAKAENA-4M IT.
