MTFC32GAKAEJP-5M AIT TR
| Part Description |
IC FLASH 256GBIT MMC 153VFBGA |
|---|---|
| Quantity | 629 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-VFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-VFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC32GAKAEJP-5M AIT TR – e•MMC™ 256 Gbit NAND Flash, 153-VFBGA
The MTFC32GAKAEJP-5M AIT TR from Micron Technology Inc. is a 256 Gbit non-volatile NAND flash memory device organized as 32G × 8 and presented with an MMC-compatible interface. It is supplied in a 153‑VFBGA package (11.5 × 13 mm).
With e•MMC™ series architecture and a wide operating temperature range of −40°C to 85°C (TA), the device addresses embedded storage requirements where high density, MMC interface connectivity, and a compact package footprint are required.
Key Features
- Memory Capacity & Organization 256 Gbit total capacity, organized as 32G × 8 to provide byte-wide memory access.
- Technology Non-volatile NAND flash memory technology suitable for persistent data storage.
- Interface MMC-compatible memory interface consistent with the e•MMC™ series for embedded storage integration.
- Package 153‑VFBGA package (11.5 × 13 mm) for compact board-level integration.
- Operating Temperature Rated for operation from −40°C to 85°C (TA), supporting a range of temperature environments.
Typical Applications
- Embedded e•MMC storage Integration as high-density non-volatile storage in systems that use an MMC interface.
- System firmware and image storage Storage of firmware, system images, or persistent system data requiring NAND flash capacity.
- Multimedia content storage Local content storage in devices that require a high-capacity MMC-connected memory device.
- Compact board-level designs Use where a small 153‑VFBGA package is needed to minimize PCB footprint while providing large memory capacity.
Unique Advantages
- High-density storage: 256 Gbit capacity enables large amounts of non-volatile data on a single device.
- MMC/e•MMC compatibility: MMC interface and e•MMC™ series alignment simplify integration into MMC-based designs.
- Compact package: 153‑VFBGA (11.5 × 13 mm) reduces board space compared with larger package options.
- Wide operating temperature: −40°C to 85°C (TA) rating supports deployment across varied thermal conditions.
- Byte-wide organization: 32G × 8 memory organization provides straightforward byte-oriented access for embedded systems.
Why Choose IC FLASH 256GBIT MMC 153VFBGA?
The MTFC32GAKAEJP-5M AIT TR positions itself as a high-capacity, MMC-interface NAND flash solution for embedded applications requiring persistent storage in a compact footprint. Its 256 Gbit density and 32G × 8 organization deliver substantial on-board storage while the 153‑VFBGA package supports space-constrained designs.
Engineers and procurement teams seeking a Micron e•MMC™ series device with a defined operating temperature range and MMC connectivity will find this part suitable for embedded storage, firmware retention, and content storage needs where a compact, non-volatile memory solution is required.
Request a quote or submit an inquiry for pricing and availability of the MTFC32GAKAEJP-5M AIT TR to proceed with evaluation or procurement.
