MTFC32GAKAEJP-4M IT TR
| Part Description |
IC FLASH 256GBIT MMC 153VFBGA |
|---|---|
| Quantity | 559 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-VFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-VFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC32GAKAEJP-4M IT TR – 256 Gbit e•MMC NAND Flash, 153-VFBGA
The MTFC32GAKAEJP-4M IT TR is a 256 Gbit non-volatile flash memory device in Micron's e•MMC™ series. It implements NAND flash technology with a MMC memory interface and a memory organization of 32G × 8.
Packaged in a 153-VFBGA (11.5x13) form factor and specified for an operating ambient range of -40°C to 85°C, the device is intended for MMC-based storage applications and embedded designs that require high-density flash in a compact package.
Key Features
- Memory Core NAND flash technology providing non-volatile data storage.
- Capacity 256 Gbit memory size suitable for high-capacity storage requirements.
- Memory Organization Organized as 32G × 8 to define the device's internal structure.
- Interface MMC memory interface compatible with e•MMC™ series designs.
- Package 153-VFBGA package case with dimensions listed as 11.5x13 for compact board-level integration.
- Operating Temperature Rated for -40°C to 85°C (TA) to support a wide ambient operating range.
Typical Applications
- MMC-based storage systems — Used where an MMC interface is required for onboard flash storage.
- Embedded storage designs — Provides high-density non-volatile memory for embedded applications with limited board space.
- Systems requiring wide temperature operation — Suitable for designs that operate across the specified -40°C to 85°C ambient range.
Unique Advantages
- High-density storage: 256 Gbit capacity addresses large onboard data storage needs without external memory arrays.
- Standard MMC interface: e•MMC™ compatible interface enables integration into MMC-based designs.
- Compact package: 153-VFBGA (11.5x13) package minimizes PCB area for space-constrained applications.
- Wide operating temperature: Specified -40°C to 85°C for use in varied ambient conditions.
- NAND flash non-volatile memory: Retains data without power, suitable for persistent storage requirements.
- Defined memory organization: 32G × 8 structure provides a clear layout for capacity and interface planning.
Why Choose IC FLASH 256GBIT MMC 153VFBGA?
The IC FLASH 256GBIT MMC 153VFBGA combines a high 256 Gbit NAND flash capacity with an MMC interface and a compact 153-VFBGA package, making it suitable for MMC-oriented embedded storage designs that need substantial onboard non-volatile memory. Its -40°C to 85°C operating range and defined memory organization support integration into systems with moderate environmental requirements and clear capacity planning needs.
This device is appropriate for designers seeking a high-density e•MMC™ memory component in a small form factor, where the priority is reliable non-volatile storage, MMC interface compatibility, and a specified ambient temperature range.
Request a quote or submit an inquiry to obtain availability and pricing information for the MTFC32GAKAEJP-4M IT TR.
