MTFC32GAKAEEF-O1 AIT
| Part Description |
IC FLASH 256GBIT MMC 169TFBGA |
|---|---|
| Quantity | 195 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 169-TFBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 169-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC32GAKAEEF-O1 AIT – IC FLASH 256Gbit MMC 169-TFBGA
The MTFC32GAKAEEF-O1 AIT from Micron Technology Inc. is a 256 Gbit non-volatile NAND flash memory device in the e•MMC™ series. It implements a 32G × 8 memory organization and provides an MMC interface in a 169‑TFBGA (14×18) package.
This device is intended for systems that require onboard NAND flash storage with MMC interface compatibility and a specified operating ambient temperature range of −40°C to 85°C.
Key Features
- Memory Type: Non-volatile FLASH (NAND) memory providing persistent storage.
- Capacity and Organization: 256 Gbit total capacity with a 32G × 8 memory organization.
- Interface: MMC memory interface suitable for e•MMC™ series implementations.
- Package: 169‑TFBGA package (14×18) for surface-mount system integration.
- Operating Temperature: Specified ambient range of −40°C to 85°C (TA).
- Series and Manufacturer: e•MMC™ series by Micron Technology Inc.
Typical Applications
- MMC-based embedded systems: Use as onboard non-volatile storage where an MMC interface is required and a 256 Gbit capacity is needed.
- Industrial equipment: Suitable for designs requiring NAND flash that operates across an ambient range of −40°C to 85°C.
- Compact board-level storage: Integration into space-constrained assemblies benefiting from the 169‑TFBGA (14×18) package.
Unique Advantages
- High raw capacity: 256 Gbit of NAND flash supports large onboard storage requirements within a single device.
- Defined memory organization: 32G × 8 organization provides a clear internal memory structure for system implementation.
- Standard MMC interface: e•MMC™ interface simplifies integration into MMC-compatible host designs.
- Wide ambient temperature range: Rated for −40°C to 85°C (TA) to address environments with varied thermal requirements.
- Surface-mount TFBGA package: 169‑TFBGA (14×18) offers a compact footprint for board-level mounting.
Why Choose MTFC32GAKAEEF-O1 AIT?
The MTFC32GAKAEEF-O1 AIT combines a 256 Gbit NAND FLASH capacity with an MMC interface and a compact 169‑TFBGA package, providing a clear option for designs that require substantial onboard non-volatile storage within a defined temperature range. As part of Micron's e•MMC™ series, it aligns with MMC-interface implementations where integrated flash memory is required.
This device is suited to engineers and procurement teams specifying MMC-compatible flash memory for systems demanding a specific capacity, package footprint, and ambient operating range. Its defined memory organization and package information facilitate PCB integration and system-level planning.
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