MTFC32GAKAEDQ-AIT TR
| Part Description |
IC FLASH 256GBIT MMC 100LBGA |
|---|---|
| Quantity | 447 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 100-LBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 100-LBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | OBSOLETE | HTS Code | 8542.32.0071 |
Overview of MTFC32GAKAEDQ-AIT TR – IC FLASH 256 Gbit MMC 100‑LBGA
The MTFC32GAKAEDQ-AIT TR is a 256 Gbit non-volatile NAND flash memory device in Micron's e•MMC™ series. It features a 32G × 8 memory organization and an MMC memory interface for embedded storage applications.
Designed for systems that require high-density flash in a compact package, the device offers a 100‑LBGA (14×18) package, a wide supply voltage range of 2.7 V to 3.6 V, and an operating temperature range of −40 °C to 85 °C to support a variety of environmental conditions.
Key Features
- Memory Type & Technology Non-volatile NAND flash memory formatted as FLASH with a total capacity of 256 Gbit (32G × 8 organization).
- Interface MMC memory interface for standardized embedded storage connectivity.
- Power Operates from a 2.7 V to 3.6 V supply voltage range, compatible with common system power rails.
- Package 100‑lead LGA package (100‑LBGA) with a 14×18 mm footprint for compact board-level integration.
- Temperature Range Specified operating ambient temperature from −40 °C to 85 °C for use in a range of environmental conditions.
- Manufacturer & Series Micron Technology Inc., e•MMC™ series device.
Typical Applications
- Embedded Storage: Use as onboard non-volatile storage where a 256 Gbit NAND FLASH device with an MMC interface is required.
- Industrial Equipment: Integration into systems that benefit from the device's −40 °C to 85 °C operating range and compact 100‑LBGA package.
- Compact Systems: Suitable for designs needing high-density FLASH in a 14×18 mm package footprint and standard MMC connectivity.
Unique Advantages
- High Density Storage: 256 Gbit capacity reduces the need for additional external memory components.
- Standard MMC Interface: Enables straightforward integration with host controllers supporting MMC protocols.
- Wide Supply Range: 2.7 V to 3.6 V operation aligns with common system power rails to simplify power design.
- Compact Package: 100‑LBGA (14×18) package balances board space efficiency and routing convenience.
- Extended Operating Temperature: −40 °C to 85 °C specification supports deployment across a range of ambient conditions.
Why Choose IC FLASH 256GBIT MMC 100LBGA?
The MTFC32GAKAEDQ-AIT TR positions itself as a high-density e•MMC™ NAND flash option for designs that require a reliable 256 Gbit non-volatile memory with a standard MMC interface. Its combination of capacity, compact 100‑LBGA package, broad supply voltage window, and extended operating temperature makes it suitable for embedded systems and compact devices where board space and environmental range are important.
Engineers specifying this device can expect a straightforward integration path for applications needing significant on-board FLASH capacity while maintaining compatibility with MMC host interfaces and common power rails.
Request a quote or submit an inquiry for pricing and availability to evaluate the MTFC32GAKAEDQ-AIT TR for your next design.
