MTFC32GAKAEDQ-AAT TR
| Part Description |
IC FLASH 256GBIT MMC 100LBGA |
|---|---|
| Quantity | 278 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 100-LBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 100-LBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC32GAKAEDQ-AAT TR – IC FLASH 256Gbit MMC, 100-LBGA
The MTFC32GAKAEDQ-AAT TR from Micron Technology Inc. is a non-volatile NAND flash memory device in the e•MMC™ series, offering 256 Gbit of on-board storage organized as 32G × 8. It provides MMC interface connectivity in a compact 100-LBGA (14 × 18) package.
Designed for systems that require integrated flash storage, this device combines high-density NAND technology with a defined operating temperature range of -40°C to 105°C (TA), making it suitable for designs that need persistent storage across a broad thermal envelope.
Key Features
- Memory Type & Technology Non-volatile FLASH using NAND technology as specified in the product data.
- Memory Capacity & Organization 256 Gbit total capacity, organized as 32G × 8 to present byte-wide data organization.
- Interface MMC memory interface for integration into MMC-compatible system designs.
- Package 100-LBGA package (14 × 18) providing a compact footprint for board-level integration.
- Operating Temperature Rated for -40°C to 105°C (TA), supporting designs that require wide ambient temperature operation.
Typical Applications
- Embedded Systems Provides on-board non-volatile NAND flash storage where MMC interface-based memory is required.
- Data Storage Modules Used as high-density flash memory in modules that need 256 Gbit capacity in a compact package.
- Industrial Electronics Suitable for electronic equipment that benefits from a wide operating temperature range and integrated flash memory.
Unique Advantages
- High-density storage: 256 Gbit capacity supports larger data and firmware storage needs without external memory expansion.
- Byte-oriented organization: 32G × 8 organization presents an 8-bit data interface for straightforward memory mapping.
- MMC interface integration: MMC interface simplifies direct integration into MMC-compatible host controllers.
- Compact BGA package: 100-LBGA (14 × 18) package minimizes board area for space-constrained designs.
- Wide operating temperature: -40°C to 105°C (TA) rating supports deployments across varying thermal environments.
Why Choose IC FLASH 256GBIT MMC 100LBGA?
The MTFC32GAKAEDQ-AAT TR positions itself as a high-capacity, MMC-interface NAND flash device offering a compact 100-LBGA footprint and a wide operating temperature range. Its 256 Gbit density and 32G × 8 organization make it suitable for designs that require substantial non-volatile storage in a small package.
This device is appropriate for engineers and procurement teams specifying integrated flash memory for embedded, module-based, or industrial applications where space, capacity, and thermal range are determinative factors. Choosing this part supports long-term design stability through a defined set of memory, interface, and package attributes from Micron Technology Inc.
Request a quote or contact sales to discuss availability, pricing, and volume options for the MTFC32GAKAEDQ-AAT TR.
