MTFC32GAKAEEF-AAT
| Part Description |
IC FLASH 256GBIT MMC 169TFBGA |
|---|---|
| Quantity | 899 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 169-TFBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 169-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC32GAKAEEF-AAT – IC FLASH 256GBIT MMC 169TFBGA
The MTFC32GAKAEEF-AAT is a 256 Gbit non-volatile NAND flash memory device in Micron Technology Inc.'s e•MMC™ series. It implements a 32G × 8 memory organization and presents an MMC memory interface for integration into storage subsystems.
Key attributes visible in the device specification include high-density flash capacity, a 169-TFBGA (14×18) package, and a wide operating temperature range of -40°C to 105°C (TA), providing a compact, thermally resilient storage option for designs that require on-board non-volatile memory.
Key Features
- Memory Type & Technology Non-volatile FLASH - NAND technology providing persistent data storage without power.
- Density & Organization 256 Gbit total capacity organized as 32G × 8 to present a high-density memory footprint.
- Interface MMC memory interface for standardized integration into systems that support MMC connectivity.
- Package 169-TFBGA package (14×18) for PCB-mounted, ball-grid style integration in space-conscious designs.
- Operating Temperature Rated for -40°C to 105°C (TA), enabling operation across an extended thermal range.
- Series & Manufacturer Part of the e•MMC™ series from Micron Technology Inc., identified by part number MTFC32GAKAEEF-AAT.
Unique Advantages
- High-density storage: 256 Gbit capacity enables consolidation of large datasets in a single device footprint.
- Standard MMC interface: Simplifies digital integration where MMC connectivity is supported, using a well-defined memory interface.
- Compact BGA footprint: The 169-TFBGA (14×18) package minimizes board area for designs constrained by PCB space.
- Wide operating temperature: -40°C to 105°C (TA) supports deployment in thermally demanding environments.
- Non-volatile NAND technology: Retains data without power, suitable for persistent storage requirements.
Why Choose IC FLASH 256GBIT MMC 169TFBGA?
The MTFC32GAKAEEF-AAT combines high-capacity NAND flash in a compact 169-TFBGA package with a standard MMC interface, presenting a direct option for designs that require on-board non-volatile storage at 256 Gbit density. Its specified temperature range and Micron e•MMC™ series identity make it suitable where device-level thermal resilience and manufacturer-backed component selection are priorities.
This part is appropriate for customers and designs that need a single-device, high-density memory solution with MMC connectivity and a compact BGA footprint, offering a straightforward path to integrate persistent storage while referencing Micron Technology Inc. as the manufacturer.
Request a quote or contact sales to discuss pricing, availability, and lead time for the MTFC32GAKAEEF-AAT.
