MTFC32GAKAEEF-O1 AIT TR
| Part Description |
IC FLASH 256GBIT MMC 169TFBGA |
|---|---|
| Quantity | 1,682 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 169-TFBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 169-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC32GAKAEEF-O1 AIT TR – IC FLASH 256GBIT MMC 169TFBGA
The MTFC32GAKAEEF-O1 AIT TR is a Micron e•MMC™ non-volatile flash memory device with a 256 Gbit capacity. Implemented in NAND flash technology and organized as 32G × 8, it provides on-board MMC interface storage in a compact 169-TFBGA (14×18) package.
Key product attributes visible in this device include its high-density 256 Gbit capacity, MMC memory interface, NAND flash technology, and an operating temperature range of -40°C to 85°C for deployment in temperature-sensitive designs.
Key Features
- Memory Capacity and Organization 256 Gbit total capacity, organized as 32G × 8 for byte-wide access.
- Technology FLASH - NAND non-volatile memory format.
- Memory Interface MMC interface for embedded storage integration.
- Package 169-TFBGA package, 14×18 body size, suitable for board-level mounting.
- Operating Temperature Range Specified for -40°C to 85°C (TA).
- Series and Manufacturer Part of the e•MMC™ series from Micron Technology Inc.
Unique Advantages
- High-density storage: 256 Gbit capacity supports large on-board data and code storage in a single device.
- Byte-wide memory organization: 32G × 8 arrangement enables straightforward byte-oriented access patterns.
- MMC interface connectivity: MMC-interface memory simplifies integration where MMC storage is required.
- Compact TFBGA footprint: 169-TFBGA (14×18) package conserves PCB area while providing board-mountable flash.
- Wide operating range: -40°C to 85°C rating accommodates a range of ambient temperature conditions.
- Proven NAND flash format: FLASH memory format offers persistent, non-volatile storage for embedded designs.
Why Choose IC FLASH 256GBIT MMC 169TFBGA?
The MTFC32GAKAEEF-O1 AIT TR positions as a high-density, MMC-interface NAND flash device that consolidates large non-volatile storage into a compact 169-TFBGA package. Its 256 Gbit capacity and 32G × 8 organization make it suitable for designs that require substantial on-board flash memory with MMC connectivity.
Produced by Micron Technology Inc. and offered in the e•MMC™ series, this device provides a straightforward memory option for customers specifying NAND-based MMC storage with a defined operating temperature range and package footprint.
Request a quote or submit a pricing and availability inquiry to receive detailed purchasing information for the MTFC32GAKAEEF-O1 AIT TR.
