MTFC32GAKAEJP-4M IT
| Part Description |
IC FLASH 256GBIT MMC 153VFBGA |
|---|---|
| Quantity | 56 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-VFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-VFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | N/A | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC32GAKAEJP-4M IT – IC FLASH 256GBIT MMC 153VFBGA
The MTFC32GAKAEJP-4M IT from Micron Technology Inc. is a 256 Gbit e•MMC™ non-volatile FLASH memory device in a 153‑VFBGA package. It features NAND FLASH technology with a 32G × 8 memory organization and an MMC interface for embedded storage applications.
Designed for compact system integration and extended ambient operation, the device targets designs that require high-density, on-board non-volatile memory in a small BGA footprint.
Key Features
- Memory Type & Technology Non-volatile FLASH - NAND memory providing persistent storage.
- Memory Capacity & Organization 256 Gbit total capacity organized as 32G × 8.
- Interface MMC memory interface suitable for embedded MMC host controllers.
- Package 153‑VFBGA package in a 11.5×13 mm footprint for compact board-level integration.
- Operating Temperature Rated for operation from −40°C to 85°C (TA) to support a range of ambient conditions.
- Series & Manufacturer Part of the e•MMC™ series from Micron Technology Inc.
Typical Applications
- Embedded storage On-board non-volatile storage where an MMC interface and high capacity are required.
- Firmware and system image storage Retention of firmware, boot images, and system data in a compact package.
- Space-constrained devices Compact 153‑VFBGA package supports integration into small form-factor electronics.
- Temperature-sensitive deployments Operation across −40°C to 85°C supports applications with extended ambient temperature requirements.
Unique Advantages
- High-density storage: 256 Gbit capacity enables substantial on-board data and system image storage without external media.
- Compact BGA package: 153‑VFBGA (11.5×13 mm) reduces PCB area for space-constrained designs.
- Standard MMC interface: MMC interface simplifies integration with MMC-compatible host controllers.
- Extended temperature range: Rated −40°C to 85°C to accommodate a wide range of ambient operating conditions.
- Clear memory organization: 32G × 8 organization provides an explicit mapping for capacity planning and memory management.
Why Choose IC FLASH 256GBIT MMC 153VFBGA?
The MTFC32GAKAEJP-4M IT offers a clear specification set for designers requiring 256 Gbit of non-volatile NAND FLASH in an e•MMC™ package. Its combination of high capacity, MMC interface, and a compact 153‑VFBGA footprint make it suitable for embedded systems where board space and on-board persistent storage are priorities.
With operation specified from −40°C to 85°C and a defined memory organization, the device is appropriate for projects that need verifiable, compact MMC-based storage solutions from Micron Technology Inc.
Request a quote or contact sales to discuss availability and pricing for the MTFC32GAKAEJP-4M IT.
