MTFC32GAKAEJP-AIT TR
| Part Description |
IC FLASH 256GBIT MMC 153VFBGA |
|---|---|
| Quantity | 247 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-VFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-VFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC32GAKAEJP-AIT TR – IC FLASH 256 Gbit MMC 153-VFBGA
The MTFC32GAKAEJP-AIT TR is a non-volatile FLASH NAND memory device in Micron's e•MMC™ series. It provides 256 Gbit of embedded storage in an MMC memory-interface format, organized as 32G × 8.
Designed for board-level integration, this device delivers high-density NAND storage in a compact 153-VFBGA (11.5×13 mm) package and supports an operating ambient temperature range of -40°C to 85°C (TA).
Key Features
- Technology NAND FLASH non-volatile memory architecture suitable for embedded storage applications.
- Memory Capacity 256 Gbit total capacity, organized as 32G × 8 for byte-wide access.
- Memory Interface MMC interface implemented for standard embedded memory connectivity.
- Package 153-VFBGA package case, dimensions 11.5×13 mm, optimized for compact board-level integration.
- Operating Temperature Specified ambient operating range of -40°C to 85°C (TA) for use in a variety of thermal environments.
- Series and Manufacturer Part of Micron Technology Inc.’s e•MMC™ series, delivered under part number MTFC32GAKAEJP-AIT TR.
Typical Applications
- Embedded storage systems — Provides non-volatile NAND flash storage where an MMC interface is required for system memory.
- Industrial equipment — The -40°C to 85°C ambient operating range supports deployment in temperature-variable environments.
- Space-constrained board designs — The 153-VFBGA (11.5×13 mm) package enables high-density storage in compact form factors.
Unique Advantages
- High-density storage: 256 Gbit capacity supports large embedded data and code storage requirements.
- Byte-wide organization: 32G × 8 memory organization provides a straightforward data layout for MMC-based systems.
- Compact package: 153-VFBGA (11.5×13 mm) reduces board area for designs with limited space.
- Wide temperature tolerance: Rated for -40°C to 85°C (TA), enabling use across a range of ambient conditions.
- MMC interface compatibility: Standard MMC interface simplifies integration with MMC host controllers.
- Micron e•MMC series: Delivered by Micron Technology Inc., identifying the device within a known memory product family.
Why Choose IC FLASH 256GBIT MMC 153VFBGA?
The MTFC32GAKAEJP-AIT TR positions itself as a compact, high-capacity e•MMC NAND flash solution suitable for embedded designs that require 256 Gbit of non-volatile storage with an MMC interface. Its 153-VFBGA package and -40°C to 85°C ambient rating make it appropriate for board-level integration in space- and temperature-constrained systems.
This part is aimed at designers and procurement teams specifying embedded memory where capacity, package density, and a standard MMC interface are primary considerations. Backed by Micron Technology Inc.’s e•MMC series designation, it provides a clear specification set for integration and long-term bill-of-material planning.
Request a quote or submit an inquiry for pricing and availability for MTFC32GAKAEJP-AIT TR to receive further procurement information and lead-time details.
