MTFC32GAPALBH-AAT ES
| Part Description |
IC FLASH 256GBIT MMC 153TFBGA |
|---|---|
| Quantity | 639 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-TFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 1 (Unlimited) | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC32GAPALBH-AAT ES – IC FLASH 256GBIT MMC 153TFBGA
The MTFC32GAPALBH-AAT ES is a Micron e•MMC™ non-volatile memory device delivering 256 Gbit of FLASH NAND storage in a 32G × 8 organization. It implements an MMC memory interface and is supplied in a 153-TFBGA package measuring 11.5 × 13 mm.
With a wide operating temperature range of -40°C to 105°C (TA) and a compact TFBGA footprint, this device addresses designs that require high-density, board-mounted non-volatile storage using an MMC interface.
Key Features
- Memory Core: 256 Gbit capacity organized as 32G × 8, providing high-density NAND FLASH storage.
- Technology: FLASH - NAND non-volatile memory format for persistent data retention.
- Memory Interface: MMC interface for host connectivity using the e•MMC™ series architecture.
- Package: 153-TFBGA package (11.5 × 13 mm) for compact board-level integration.
- Operating Temperature: Rated for -40°C to 105°C (TA), suitable for temperature-challenging environments.
- Manufacturer and Series: Micron Technology Inc., e•MMC™ series, part number MTFC32GAPALBH-AAT ES.
Typical Applications
- Embedded storage: On-board non-volatile storage for systems that require MMC-connected FLASH capacity.
- System firmware and boot storage: Retention of firmware and boot images where compact board-mounted memory is needed.
- Data logging and local storage: High-density NAND capacity for local data retention in space-constrained designs.
- Temperature-challenged equipment: Use in systems operating across -40°C to 105°C (TA) that require stable non-volatile memory.
Unique Advantages
- High-density storage: 256 Gbit capacity enables substantial on-board data or firmware storage within a single device.
- Compact BGA footprint: 153-TFBGA (11.5 × 13 mm) package reduces board area compared with larger module approaches.
- Integrated MMC interface: Native MMC interface simplifies integration with MMC-capable host controllers.
- Wide temperature rating: -40°C to 105°C (TA) supports deployment in environments with broad thermal ranges.
- Proven NAND FLASH technology: FLASH - NAND non-volatile memory format for persistent data storage.
- Manufacturer backing: Supplied by Micron Technology Inc., part of the e•MMC™ series.
Why Choose IC FLASH 256GBIT MMC 153TFBGA?
The MTFC32GAPALBH-AAT ES positions itself as a high-capacity, board-mounted e•MMC™ NAND FLASH solution that combines 256 Gbit density with a compact 153-TFBGA package and an MMC interface. Its -40°C to 105°C operating range makes it suitable for designs that need persistent storage across a wide temperature span.
This device is appropriate for engineers and procurement teams seeking a Micron-supplied MMC FLASH memory solution for embedded storage, firmware retention, or local data logging where board space and thermal performance are important considerations.
Request a quote or contact sales to discuss availability and pricing for MTFC32GAPALBH-AAT ES.
