MTFC32GAPALBH-AIT
| Part Description |
IC FLASH 256GBIT MMC 153TFBGA |
|---|---|
| Quantity | 477 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-TFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC32GAPALBH-AIT – IC FLASH 256GBIT MMC 153TFBGA
The MTFC32GAPALBH-AIT is a 256 Gbit NAND flash memory device in Micron's e•MMC™ series, delivered in a 153-TFBGA package (11.5 × 13 mm). It provides high-density, non-volatile storage with an MMC memory interface for embedded storage applications.
With a 32G × 8 memory organization and an operating temperature range of −40°C to 85°C, this product targets systems that require compact, high-capacity flash in a thermally robust package.
Key Features
- Memory Type Non-volatile NAND flash memory suitable for persistent data storage.
- Capacity & Organization 256 Gbit total capacity with a 32G × 8 memory organization for high-density storage.
- Interface MMC memory interface provided as part of the e•MMC™ series for embedded storage integration.
- Package 153-TFBGA package with dimensions 11.5 × 13 mm to support compact board layouts.
- Temperature Range Rated for operation from −40°C to 85°C (TA) for use in temperature-variable environments.
- Manufacturer & Series Micron Technology Inc., e•MMC™ series.
Typical Applications
- Embedded Storage: Provides 256 Gbit of non-volatile storage for systems requiring an MMC interface and high capacity in a compact package.
- Industrial Equipment: Suitable for instrumentation and control systems that operate across −40°C to 85°C and need reliable onboard flash storage.
- Consumer Devices: Fits designs that require integrated MMC flash memory in a small BGA footprint.
Unique Advantages
- High Density 256 Gbit Capacity: Enables large storage volumes in a single memory device, reducing the need for multiple chips.
- Compact 153-TFBGA Package: Small 11.5 × 13 mm footprint supports space-constrained PCB designs.
- Standard MMC Interface: e•MMC™ interface simplifies integration into systems designed for MMC memory connectivity.
- Wide Operating Temperature: −40°C to 85°C rating supports deployment in thermally diverse environments.
- NAND Flash Technology: Non-volatile FLASH - NAND memory format for persistent data retention.
Why Choose IC FLASH 256GBIT MMC 153TFBGA?
The MTFC32GAPALBH-AIT combines high-capacity 256 Gbit NAND flash with an MMC interface in a compact 153-TFBGA package, making it suitable for designs that demand dense, onboard non-volatile storage and a small PCB footprint. Its −40°C to 85°C operating range supports applications that operate across extended temperature conditions.
As part of Micron Technology Inc.'s e•MMC™ series, this device is positioned for engineers and procurement teams seeking a verified, high-density flash option that balances capacity, package size, and temperature tolerance for embedded systems.
Request a quote or submit a pricing inquiry to receive availability and lead-time information for the MTFC32GAPALBH-AIT.
