MTFC32GAPALBH-AAT ES TR
| Part Description |
IC FLASH 256GBIT MMC 153TFBGA |
|---|---|
| Quantity | 725 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-TFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 1 (Unlimited) | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC32GAPALBH-AAT ES TR – 256 Gbit e•MMC™ NAND Flash, 153-TFBGA
The MTFC32GAPALBH-AAT ES TR is a 256 Gbit non-volatile NAND flash memory device in Micron's e•MMC™ series. It is organized as 32G × 8 and presented in a 153-TFBGA package (11.5 × 13 mm).
This device is intended for embedded storage applications that require high-density NAND flash with an MMC interface and a wide operating temperature range of −40°C to 105°C.
Key Features
- Memory Technology NAND flash non-volatile memory providing 256 Gbit of storage capacity in FLASH format.
- Memory Organization Organized as 32G × 8 to present the 256 Gbit capacity in a byte-wide format.
- Interface MMC memory interface for integration into systems that support MMC storage.
- Package 153-TFBGA standard package, specified as 11.5 × 13 mm, suitable for compact board-level integration.
- Operating Temperature Rated for −40°C to 105°C (TA), supporting designs that require extended temperature operation.
- Series Part of the e•MMC™ series for systems designed around MMC-based onboard flash storage.
Typical Applications
- Embedded Storage — Provides high-density non-volatile storage for embedded systems that use an MMC interface.
- Industrial Systems — Wide operating temperature range (−40°C to 105°C) supports deployment in industrial environments.
- Compact Board-Level Integration — 153-TFBGA (11.5 × 13 mm) package enables space-constrained designs requiring on-board flash.
Unique Advantages
- High Capacity (256 Gbit): Enables large data storage in a single device for firmware, file systems, or application data.
- MMC Interface: Simplifies integration into systems that leverage MMC protocol for removable or onboard storage.
- Robust Temperature Range: −40°C to 105°C rating supports reliable operation across broad environmental conditions.
- Compact TFBGA Package: 153-TFBGA (11.5 × 13 mm) offers a small footprint for space-limited PCB layouts.
- NAND Flash Technology: FLASH - NAND memory format provides non-volatile storage suitable for persistent data retention.
Why Choose IC FLASH 256GBIT MMC 153TFBGA?
The IC FLASH 256GBIT MMC 153TFBGA (MTFC32GAPALBH-AAT ES TR) positions itself as a high-density e•MMC™ NAND flash option for designs needing 256 Gbit of non-volatile storage with an MMC interface. Its 32G × 8 organization and compact 153-TFBGA package make it suitable for embedded systems where board space and storage capacity are key considerations.
With a specified operating range from −40°C to 105°C, this device is appropriate for applications that require extended temperature performance while maintaining a standard MMC integration approach for storage management.
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