MTFC32GAPALGT-S1 IT

The MTFC32GAPALGT-S1 IT is a 256 Gbit non-volatile NAND flash memory device in the e•MMC™ series. It uses SLC NAND technology organized as 32G × 8 with an eMMC_5.1 memory interface and a 200 MHz clock frequency.

This device is intended for embedded storage applications that require on-board flash memory in a compact 153-TFBGA (11.5 × 13 mm) package, supporting a 2.7 V to 3.6 V supply range and an operating temperature span of -40°C to 85°C.

Key Features

• Memory Core  256 Gbit NAND flash organized as 32G × 8, providing high-density non-volatile storage in a single device.
• Technology  SLC NAND technology for the flash array as specified in the product data.
• Interface  eMMC_5.1 memory interface for integrated embedded storage connectivity.
• Performance  200 MHz clock frequency documented for device timing and operation.
• Power  Operates from a 2.7 V to 3.6 V supply range, compatible with common embedded power domains.
• Package  153-TFBGA package, dimensions 11.5 × 13 mm, suitable for board-level integration where compact footprint is required.
• Environmental  Rated for an operating temperature range of -40°C to 85°C (TA).

Typical Applications

• Embedded storage: Provides on-board non-volatile storage for embedded systems requiring a compact eMMC solution.
• Consumer electronics: Use as integrated flash memory in consumer devices that accept eMMC_5.1 interface modules.
• Industrial equipment: Fits industrial applications operating within -40°C to 85°C that need high-density flash in a small package.
• Networking and appliances: Suitable for appliance-level storage where a 2.7 V–3.6 V supply and BGA mounting are standard.

Unique Advantages

• High-density storage: 256 Gbit capacity (32G × 8) enables substantial on-board data storage within a single device.
• SLC NAND technology: The specified FLASH - NAND (SLC) provides the flash type documented for this part.
• eMMC_5.1 interface: Native eMMC_5.1 support simplifies integration with host controllers that use this interface standard.
• Compact BGA package: 153-TFBGA (11.5 × 13 mm) package reduces board area for high-density designs.
• Wide operating conditions: Operates across -40°C to 85°C and a 2.7 V–3.6 V supply range to accommodate varied embedded environments.
• Defined timing : 200 MHz clock frequency is provided as part of the device specification for system timing design.

Why Choose IC FLASH 256GBIT MMC 153WFBGA?

This e•MMC™ series device combines a high 256 Gbit SLC NAND array with an eMMC_5.1 interface and a defined 200 MHz clock frequency, packaged in a compact 153-TFBGA footprint. Its supply voltage range and -40°C to 85°C operating window make it suitable for embedded designs that require dense, on-board non-volatile storage without external flash components.

The MTFC32GAPALGT-S1 IT is well suited to designers seeking an integrated flash memory solution where capacity, package size, and eMMC_5.1 interface compatibility are primary selection criteria, offering straightforward board-level integration and predictable electrical and thermal parameters.

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