MTFC32GAPALNA-AAT ES TR
| Part Description |
IC FLASH 256GBIT MMC 100TBGA |
|---|---|
| Quantity | 89 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 6 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 100-TBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC32GAPALNA-AAT ES TR – IC FLASH 256GBIT MMC 100TBGA
The MTFC32GAPALNA-AAT ES TR is a 256 Gbit non-volatile NAND flash memory device in an e•MMC™ format with an MMC interface. It provides a 32G × 8 memory organization in a compact 100-TBGA (14×18) package and operates across a wide industrial temperature range.
This device is intended for designs that require MMC-based flash storage with high density and a compact BGA footprint, supporting operation from −40°C to 105°C (TA).
Key Features
- Memory Type Non-volatile FLASH - NAND memory suitable for persistent data storage.
- Memory Capacity & Organization 256 Gbit total capacity, organized as 32G × 8 for clearly defined device addressing and sizing.
- Interface MMC memory interface for integration into systems that use MMC connectivity.
- Package 100-TBGA package (14×18) providing a compact, surface-mount footprint for PCB-mounted applications.
- Operating Temperature Specified for −40°C to 105°C (TA), supporting use in environments with wide temperature variation.
- Series e•MMC™ series product from Micron Technology Inc., aligning with e•MMC form-factor expectations.
Typical Applications
- MMC-based storage systems — For designs that require MMC interface flash memory for persistent data storage and system firmware.
- Compact PCB assemblies — The 100-TBGA (14×18) package supports space-constrained board layouts where a low-profile BGA is needed.
- Temperature-sensitive deployments — Suitable for equipment operating across −40°C to 105°C where thermal range is a design requirement.
Unique Advantages
- High storage density: 256 Gbit capacity enables large data and code storage within a single device.
- Defined memory organization: 32G × 8 organization simplifies capacity planning and addressing in system design.
- Standard MMC interface: MMC connectivity facilitates integration into systems that support e•MMC-style memory interfaces.
- Compact BGA package: 100-TBGA (14×18) minimizes board area while providing a robust surface-mount solution.
- Wide operating temperature: Rated for −40°C to 105°C (TA), addressing thermal tolerance needs for diverse operating environments.
Why Choose IC FLASH 256GBIT MMC 100TBGA?
The IC FLASH 256GBIT MMC 100TBGA (MTFC32GAPALNA-AAT ES TR) delivers a high-density NAND flash option in an e•MMC™ form with MMC interface and a compact 100-TBGA package. Its 32G × 8 organization and 256 Gbit capacity make it suitable for systems that need substantial onboard non-volatile storage while conserving board space.
With an operating range from −40°C to 105°C, this Micron Technology Inc. product is positioned for designs that require reliable flash storage across wide temperature conditions and a standardized MMC connectivity model.
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