MTFC32GAPALNA-AIT
| Part Description |
IC FLASH 256GBIT MMC 100TBGA |
|---|---|
| Quantity | 905 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 100-TBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC32GAPALNA-AIT – IC FLASH 256Gbit MMC 100-TBGA
The MTFC32GAPALNA-AIT is a 256 Gbit non‑volatile NAND flash memory device in Micron's e•MMC™ series. It provides MMC interface-based flash storage in a compact 100‑TBGA (14×18) package.
Engineered for designs that require high-density embedded flash, this device offers a 32G × 8 memory organization and an extended operating temperature range of −40°C to 85°C for deployment in temperature-challenged environments.
Key Features
- Memory Technology NAND flash non‑volatile memory format providing persistent data storage.
- Capacity 256 Gbit total memory size arranged as 32G × 8 for high-density embedded storage.
- Interface MMC memory interface for integration into MMC-compatible host systems.
- Package 100‑TBGA (14×18) supplier device package for compact board-level integration.
- Operating Temperature Rated for −40°C to 85°C (TA), supporting deployment across a wide temperature range.
- Series Part of the e•MMC™ family from Micron Technology Inc., targeted at embedded memory applications.
Typical Applications
- MMC-based embedded storage — Use as onboard non‑volatile storage where MMC interface compatibility is required.
- Compact system designs — High-density 256 Gbit capacity in a 100‑TBGA package for space‑constrained PCBs.
- Temperature-challenged environments — Suitable for systems that must operate between −40°C and 85°C.
- General NAND flash applications — Provides persistent storage where NAND FLASH memory format is required.
Unique Advantages
- High storage density: 256 Gbit capacity supports large onboard data and firmware storage without additional components.
- Compact package: 100‑TBGA (14×18) reduces PCB footprint for space-sensitive designs.
- MMC interface integration: Direct MMC connectivity simplifies host interface design for compatible systems.
- Wide operating temperature: −40°C to 85°C rating enables use in a broad range of environmental conditions.
- Standardized memory organization: 32G × 8 arrangement provides a clear capacity and data-width profile for system planning.
Why Choose IC FLASH 256GBIT MMC 100TBGA?
The MTFC32GAPALNA-AIT combines high-density 256 Gbit NAND flash with an MMC interface and a compact 100‑TBGA package, making it a focused choice for embedded designs that require substantial non‑volatile storage in a small form factor. Its −40°C to 85°C operating range addresses thermal variability in many deployed systems.
This device is suited to engineers and procurement teams specifying MMC-compatible flash memory where board space, capacity, and temperature range are primary selection criteria. Its clear specification of memory organization and package simplifies system integration and layout planning.
If you need pricing, availability, or a formal quote for the MTFC32GAPALNA-AIT, request a quote or contact sales to discuss your requirements and lead times.
