MTFC32GASAONS-AAT TR
| Part Description |
IC FLASH 256GBIT UFS2.1 153TFBGA |
|---|---|
| Quantity | 438 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-TFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (SLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | 52 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TC) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | UFS2.1 | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Qualification | AEC-Q104 | ECCN | N/A | HTS Code | N/A |
Overview of MTFC32GASAONS-AAT TR – IC FLASH 256GBIT UFS2.1 153TFBGA
The MTFC32GASAONS-AAT TR is a 256 Gbit non-volatile flash memory device using SLC NAND technology and a Universal Flash Storage (UFS) 2.1 interface. It is organized as 32G × 8 and is supplied in a 153-TFBGA (11.5 × 13 mm) package.
Designed for applications requiring high-density embedded storage with defined temperature and qualification characteristics, the device provides a UFS2.1 interface, a 52 MHz clock frequency, and an operating temperature range from −40 °C to 105 °C, with AEC-Q104 qualification for automotive-grade use.
Key Features
- Memory Core 256 Gbit capacity organized as 32G × 8 using FLASH - NAND (SLC) technology for non-volatile data storage.
- Interface Universal Flash Storage (UFS) 2.1 interface for standardized high-speed embedded storage connectivity; specified clock frequency of 52 MHz.
- Package 153-TFBGA package (11.5 × 13 mm) providing a compact surface-mount form factor for board-level integration.
- Power Wide supply voltage range from 2.7 V to 3.6 V to support common embedded power rails.
- Temperature & Qualification Operating temperature range of −40 °C to 105 °C (TC) and AEC-Q104 qualification supporting automotive-grade deployment.
- Memory Format & Mounting Non-volatile FLASH memory in a surface-mount TFBGA package suitable for permanent onboard storage.
Typical Applications
- Automotive systems — Automotive-grade storage where AEC-Q104 qualification and a wide operating temperature range are required for embedded data and media.
- Embedded storage — Onboard non-volatile storage for embedded controllers and modules that use a UFS2.1 interface.
- Industrial electronics — High-density flash storage for industrial applications operating across −40 °C to 105 °C and requiring robust mounting in a TFBGA package.
Unique Advantages
- Automotive-qualified reliability: AEC-Q104 qualification and an extended −40 °C to 105 °C operating range support use in automotive environments.
- High-density storage: 256 Gbit capacity in a single 153-TFBGA package reduces board space for large onboard datasets.
- Standard UFS2.1 interface: UFS2.1 connectivity and a defined 52 MHz clock frequency enable integration with systems expecting standardized flash interfaces.
- SLC NAND technology: FLASH - NAND (SLC) memory organization (32G × 8) offers a defined non-volatile memory architecture for embedded data storage needs.
- Flexible power range: 2.7 V to 3.6 V supply compatibility simplifies integration with common embedded power rails.
- Compact surface-mount package: 153-TFBGA (11.5 × 13 mm) minimizes PCB footprint while providing a board-mounted flash solution.
Why Choose MTFC32GASAONS-AAT TR?
The MTFC32GASAONS-AAT TR positions itself as a high-density, automotive-qualified UFS2.1 flash device suitable for designs that require defined operating temperature range, established packaging, and a standardized interface. Its combination of 256 Gbit SLC NAND capacity, 153-TFBGA footprint, and AEC-Q104 qualification makes it appropriate for embedded systems and automotive applications needing reliable non-volatile storage.
Engineers specifying onboard flash will find a compact, voltage-flexible option with a clear set of electrical and environmental parameters for integration into systems that demand traceable qualifications and a UFS2.1 interface.
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