MTFC32GASAONS-AIT TR
| Part Description |
IC FLASH 256GBIT UFS2.1 153TFBGA |
|---|---|
| Quantity | 1,039 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-TFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (SLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | 52 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 95°C (TC) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | UFS2.1 | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | N/A | REACH Compliance | REACH Unaffected | ||
| Qualification | AEC-Q104 | ECCN | N/A | HTS Code | N/A |
Overview of MTFC32GASAONS-AIT TR – IC FLASH 256GBIT UFS2.1 153TFBGA
The MTFC32GASAONS-AIT TR is a 256 Gbit non-volatile flash memory device featuring a UFS 2.1 memory interface and SLC NAND technology. Packaged in a compact 153‑TFBGA (11.5 × 13 mm) form factor, it is designed to provide high-density embedded storage with a 32G × 8 memory organization and a 52 MHz clock frequency.
Targeted for automotive-grade designs, the device is qualified to AEC‑Q104 and supports operation across a temperature range of −40°C to 95°C and a supply voltage range of 2.7 V to 3.6 V.
Key Features
- Memory Core 256 Gbit capacity implemented as 32G × 8 organization using FLASH – NAND (SLC) technology.
- Interface Universal Flash Storage (UFS) 2.1 memory interface with a listed clock frequency of 52 MHz.
- Automotive Qualification AEC‑Q104 qualification indicating suitability for automotive-grade applications as specified in the product data.
- Operating Range Wide temperature tolerance from −40°C to 95°C (TC) and a supply voltage range of 2.7 V to 3.6 V.
- Package 153‑TFBGA package (11.5 × 13 mm) optimized for space-constrained board designs.
- Device Type Non-volatile FLASH memory formatted for UFS 2.1 applications and surface-mount integration.
Typical Applications
- Automotive storage systems — Memory for automotive electronic modules where AEC‑Q104 qualification and extended temperature operation are required.
- UFS 2.1-based designs — Embedded storage solutions that implement the UFS 2.1 interface and require up to 256 Gbit capacity.
- Space-constrained electronics — High-density flash in a compact 153‑TFBGA package for limited-board-area applications.
Unique Advantages
- High-density 256 Gbit capacity: Provides substantial non-volatile storage in a single 32G × 8 device.
- SLC NAND technology: Uses single-level cell flash memory as specified in the product data.
- UFS 2.1 interface: Standardized memory interface implementation with an explicit 52 MHz clock frequency listed.
- Automotive qualification (AEC‑Q104): Shown qualification for automotive applications per the provided specification.
- Extended temperature and voltage ranges: Operation from −40°C to 95°C and supply range of 2.7 V to 3.6 V support robust system-level requirements.
- Compact TFBGA package: 153‑TFBGA (11.5 × 13 mm) form factor enables integration in dense PCBs.
Why Choose IC FLASH 256GBIT UFS2.1 153TFBGA?
The MTFC32GASAONS-AIT TR combines 256 Gbit SLC NAND flash with a UFS 2.1 interface and automotive-grade qualification (AEC‑Q104), offering a compact and robust embedded storage option. Its specified operating temperature range and supply voltage make it suitable for designs that require stability across demanding environmental conditions.
This device is appropriate for engineers and procurement teams seeking a high-density, automotive-qualified UFS memory in a space-efficient 153‑TFBGA package, backed by clear electrical and environmental specifications.
Request a quote or submit a sales inquiry for the MTFC32GASAONS-AIT TR to obtain pricing, availability, and ordering information.
