MTFC32GASAONS-AAT

IC FLASH 256GBIT UFS2.1 153TFBGA
Part Description

IC FLASH 256GBIT UFS2.1 153TFBGA

Quantity 821 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-TFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND (SLC)
Memory Size256 GbitAccess TimeN/AGradeAutomotive
Clock Frequency52 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 105°C (TC)Write Cycle Time Word PageN/APackaging153-TFBGA
Mounting MethodNon-VolatileMemory InterfaceUFS2.1Memory Organization32G x 8
Moisture Sensitivity LevelN/ARoHS ComplianceUnknownREACH ComplianceREACH Unaffected
QualificationAEC-Q100ECCNN/AHTS CodeN/A

Overview of MTFC32GASAONS-AAT – IC FLASH 256GBIT UFS2.1 153TFBGA

The MTFC32GASAONS-AAT is a 256 Gbit non-volatile flash memory device implemented as SLC NAND with a UFS 2.1 interface. It is supplied in a 153-TFBGA package and is specified with automotive-grade qualifications and a wide operating temperature range.

This device targets embedded storage applications requiring high-density flash in a compact package, offering a standardized UFS2.1 interface and electrical options that support integration into automotive and other temperature-demanding systems.

Key Features

  • Core / Memory: FLASH - NAND (SLC) non-volatile memory organized as 32G × 8 to provide a total memory size of 256 Gbit.
  • Interface & Timing: UFS 2.1 memory interface with a listed clock frequency of 52 MHz for host communication timing reference.
  • Electrical: Voltage supply range of 2.7 V to 3.6 V to accommodate common embedded power domains.
  • Package: 153-TFBGA package, supplier device package dimension 11.5×13 mm, suitable for surface-mount integration.
  • Temperature & Qualification: Operating temperature range of -40°C to 105°C (TC) and AEC-Q100 qualification; device grade listed as Automotive.
  • Memory Format & Organization: Specified as FLASH memory with MemoryFormat FLASH and explicit organization of 32G × 8.

Unique Advantages

  • AEC-Q100 Automotive Qualification: The device carries AEC-Q100 qualification and an automotive grade, aligning with applications that require qualified components.
  • High Storage Density: 256 Gbit capacity provides significant on-board storage for large datasets or application code and resources.
  • Standard UFS 2.1 Interface: UFS2.1 simplifies integration with controllers that support the standard memory interface.
  • SLC NAND Technology: Single-level cell NAND flash as specified in the product data, providing the defined memory architecture for design planning.
  • Wide Operating Range: Specified -40°C to 105°C temperature range and 2.7 V–3.6 V supply range support designs operating across extended environmental conditions.

Why Choose IC FLASH 256GBIT UFS2.1 153TFBGA?

The MTFC32GASAONS-AAT combines a high 256 Gbit SLC NAND capacity with a UFS 2.1 interface and automotive AEC-Q100 qualification, positioning it for embedded systems that require qualified, high-density non-volatile storage in a compact 153-TFBGA package. Its specified operating temperature range and supply-voltage window support deployment in temperature-challenging environments.

This device is well suited for designs prioritizing standardized UFS2.1 integration, automotive-grade qualification, and high memory capacity in a small footprint, offering a clear specification set for procurement and system integration.

Request a quote or submit an inquiry to sales to discuss availability, lead times, and ordering for the MTFC32GASAONS-AAT.

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