MTFC32GASAQHD-AAT
| Part Description |
IC FLASH 256GBIT EMMC 153VFBGA |
|---|---|
| Quantity | 1,348 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 153-VFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | 200 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-VFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | AEC-Q100 | ECCN | N/A | HTS Code | N/A |
Overview of MTFC32GASAQHD-AAT – IC FLASH 256GBIT EMMC 153VFBGA
The MTFC32GASAQHD-AAT is a non-volatile NAND FLASH memory device organized as 32G × 8 for a total density of 256 Gbit. It provides an eMMC memory interface in a compact 153-VFBGA package.
Targeted for designs that require high-capacity embedded storage with automotive-grade qualification, the device offers a 200 MHz clock rate, a 2.7 V to 3.6 V supply range, and an operating temperature range of -40°C to 105°C backed by AEC-Q100 qualification.
Key Features
- Memory 256 Gbit NAND FLASH organized as 32G × 8; non-volatile memory format suitable for high-density embedded storage.
- Interface eMMC memory interface for integration into embedded systems requiring standard managed flash connectivity.
- Performance 200 MHz clock frequency to support interface timing and data transfer requirements.
- Power Voltage supply range of 2.7 V to 3.6 V to match common embedded system rails.
- Reliability & Qualification Automotive-grade device with AEC-Q100 qualification and an operating temperature range of -40°C to 105°C.
- Package 153-VFBGA package (11.5 × 13 mm) for compact board-level integration.
- Memory Organization & Format Memory organization 32G × 8 and FLASH NAND technology to provide managed, non-volatile storage.
Typical Applications
- Automotive systems — Qualified to AEC-Q100 and specified for -40°C to 105°C operation, suitable for in-vehicle systems that require qualified embedded storage.
- Embedded storage — eMMC interface and high density make the device suitable for embedded controllers and systems that need managed flash memory.
- Data logging and telemetry — High-capacity FLASH supports storage of large datasets and logs in applications operating across wide temperatures.
- Industrial equipment — Wide voltage and temperature ranges support deployment in industrial environments requiring robust non-volatile memory.
Unique Advantages
- High-density storage: 256 Gbit capacity delivered in a single eMMC device reduces external memory count and simplifies system architecture.
- Automotive-qualified reliability: AEC-Q100 qualification and -40°C to 105°C operating range support designs that require validated temperature and reliability performance.
- Standard eMMC interface: Managed flash interface eases integration with embedded SoCs and controllers that support eMMC.
- Broad supply compatibility: 2.7 V to 3.6 V operating range aligns with common embedded power rails.
- Compact package: 153-VFBGA (11.5 × 13 mm) package enables high-density board layouts without sacrificing capacity.
- NAND FLASH technology: Non-volatile FLASH storage suitable for long-term data retention in embedded applications.
Why Choose IC FLASH 256GBIT EMMC 153VFBGA?
The MTFC32GASAQHD-AAT from Micron Technology Inc. positions itself as a high-capacity, automotive-qualified eMMC FLASH device combining 256 Gbit density with a standard eMMC interface and a compact 153-VFBGA footprint. Its specified 200 MHz clock, wide voltage range, and extended temperature rating support integration into systems that require robust, managed non-volatile storage.
This device is suited for designers and procurement teams building automotive, industrial, and embedded systems that demand qualified memory components with high capacity, compact packaging, and broad operating conditions. The combination of AEC-Q100 qualification, temperature range, and eMMC interface provides a clear path for scalable, reliable storage integration in production designs.
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