MTFC32GASAQHD-AIT TR

IC FLASH 256GBIT EMMC 153VFBGA
Part Description

IC FLASH 256GBIT EMMC 153VFBGA

Quantity 244 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-VFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size256 GbitAccess TimeN/AGradeAutomotive
Clock Frequency200 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-VFBGA
Mounting MethodNon-VolatileMemory InterfaceeMMCMemory Organization32G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationAEC-Q100ECCNN/AHTS CodeN/A

Overview of MTFC32GASAQHD-AIT TR – IC FLASH 256GBIT eMMC 153-VFBGA

The MTFC32GASAQHD-AIT TR is a 256 Gbit non-volatile NAND flash memory device with an eMMC memory interface in a 153-VFBGA (11.5 × 13 mm) package. It is organized as 32G × 8 and implements NAND FLASH technology for high-density embedded storage.

Designed for applications that require automotive-grade qualification, this device is AEC-Q100 qualified and supports an operating temperature range of −40°C to 85°C. Its 200 MHz clock frequency and 2.7 V to 3.6 V supply range provide a balance of performance and integration for embedded designs.

Key Features

  • Memory Type & Technology  Non-volatile NAND FLASH memory organized as 32G × 8, providing a total capacity of 256 Gbit.
  • Interface  Standard eMMC memory interface for integrated on-board storage in embedded systems.
  • Performance  200 MHz clock frequency to support typical eMMC throughput requirements.
  • Power & Voltage  Operating supply voltage range from 2.7 V to 3.6 V for compatibility with common embedded power domains.
  • Package  153-VFBGA package (11.5 × 13 mm) for compact, high-density PCB integration.
  • Temperature & Qualification  Operating temperature −40°C to 85°C and AEC-Q100 qualification for automotive-grade reliability.

Typical Applications

  • Automotive systems  AEC-Q100 qualification and −40°C to 85°C range make the device suitable for automotive embedded storage applications.
  • Embedded systems  High-density 256 Gbit eMMC storage for embedded designs requiring non-volatile NAND flash and a standard eMMC interface.
  • Space-constrained designs  Compact 153-VFBGA (11.5 × 13 mm) package enables high-capacity storage in limited PCB area.

Unique Advantages

  • Automotive-qualified memory  AEC-Q100 qualification provides a recognized level of automotive reliability for designs that require it.
  • High storage density  256 Gbit capacity (32G × 8) supports large on-board data or code storage needs within a single component.
  • Standard eMMC interface  Simplifies integration into embedded systems that use eMMC for mass storage.
  • Wide operating temperature  −40°C to 85°C rating supports deployment across a broad range of environmental conditions.
  • Compact BGA package  153-VFBGA (11.5 × 13 mm) minimizes PCB footprint while delivering high capacity.
  • Flexible supply range  2.7 V to 3.6 V operation aligns with common embedded power rails.

Why Choose MTFC32GASAQHD-AIT TR?

The MTFC32GASAQHD-AIT TR combines high-density 256 Gbit NAND flash organized as 32G × 8 with a standard eMMC interface in a compact 153-VFBGA package. Its AEC-Q100 qualification and −40°C to 85°C operating range position it for embedded designs that require automotive-grade memory solutions.

This device is suited for designers seeking an integrated, high-capacity non-volatile memory option with a proven NAND FLASH architecture, a 200 MHz clock frequency, and a flexible 2.7 V–3.6 V supply range for streamlined integration into space-constrained and temperature-challenging applications.

Request a quote or submit an inquiry to obtain pricing and availability for the MTFC32GASAQHD-AIT TR.

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