MTFC32GAZAOTD-AAT
| Part Description |
IC FLASH 256GBIT UFS |
|---|---|
| Quantity | 982 Available (as of May 4, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-BGA | Memory Format | FLASH | Technology | FLASH - NAND (SLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | 52 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TC) | Write Cycle Time Word Page | N/A | Packaging | 153-BGA | ||
| Mounting Method | Non-Volatile | Memory Interface | UFS2.1 | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Qualification | AEC-Q100 | ECCN | N/A | HTS Code | N/A |
Overview of MTFC32GAZAOTD-AAT – IC FLASH 256GBIT UFS
The MTFC32GAZAOTD-AAT is a 256 Gbit non-volatile Universal Flash Storage (UFS) device from Micron Technology Inc., implemented with NAND SLC flash. It is organized as 32G × 8 and uses the UFS 2.1 memory interface for integration into host systems.
Designed and qualified for automotive applications, the device features AEC-Q100 qualification, a wide operating temperature range, and a compact 153-ball BGA package, making it suitable for systems that require high-density, robust non-volatile storage solutions.
Key Features
- Memory Technology Non-volatile NAND (SLC) flash delivering 256 Gbit capacity organized as 32G × 8 for high-density storage.
- Memory Interface UFS 2.1 interface for standardized host connectivity and integration into UFS-capable systems.
- Clock Frequency 52 MHz clock frequency for device timing and host interface operation.
- Voltage Supply Operates from 2.7 V to 3.6 V to match common system power rails.
- Automotive Qualification AEC-Q100 qualification indicates suitability for automotive electronic applications.
- Temperature Range Rated for −40°C to 105°C (TC) operation to support wide-temperature deployments.
- Package 153-ball BGA (153-BGA) package for compact mounting in space-constrained designs.
- Memory Format Managed flash in UFS format for non-volatile data and code storage.
Typical Applications
- Automotive electronic systems Qualified for AEC-Q100, suitable for vehicle storage functions and automotive-grade non-volatile memory requirements.
- Embedded systems with UFS support Provides high-density UFS 2.1 storage for embedded platforms that implement the UFS host interface.
- Wide-temperature deployments Applicable where operation across −40°C to 105°C is required.
Unique Advantages
- AEC-Q100 qualification: Meets automotive-grade qualification to support designs requiring certified components.
- High storage density: 256 Gbit capacity (32G × 8) enables significant on-board non-volatile storage in a single device.
- Standard UFS 2.1 interface: Facilitates integration with UFS-capable hosts and standardized system designs.
- Wide operating temperature: −40°C to 105°C rating supports demanding thermal environments.
- Flexible power range: 2.7 V to 3.6 V supply range aligns with common system power rails for straightforward power design.
- Compact BGA package: 153-BGA package conserves board area for space-constrained applications.
Why Choose IC FLASH 256GBIT UFS?
The MTFC32GAZAOTD-AAT positions itself as a high-density, automotive-qualified UFS storage option that combines SLC NAND reliability with the UFS 2.1 interface for standardized system integration. Its wide temperature rating, AEC-Q100 qualification, and compact 153-BGA package make it suitable for designs that require durable non-volatile storage in constrained form factors.
This device is appropriate for engineers and designers building automotive and embedded systems that need verified qualification, robust thermal performance, and a standardized UFS interface for data and code storage.
If you require pricing, availability, or additional technical information, request a quote or submit a pricing inquiry to our sales team to discuss your project requirements and ordering options.
