MTFC32GAZAOTD-AAT TR

IC FLASH 256GBIT UFS
Part Description

IC FLASH 256GBIT UFS

Quantity 63 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-BGAMemory FormatFLASHTechnologyFLASH - NAND (SLC)
Memory Size256 GbitAccess TimeN/AGradeAutomotive
Clock Frequency52 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 105°C (TC)Write Cycle Time Word PageN/APackaging153-BGA
Mounting MethodNon-VolatileMemory InterfaceUFS2.1Memory Organization32G x 8
Moisture Sensitivity LevelN/ARoHS ComplianceUnknownREACH ComplianceREACH Unaffected
QualificationAEC-Q100ECCNN/AHTS CodeN/A

Overview of MTFC32GAZAOTD-AAT TR – IC FLASH 256Gbit UFS

The MTFC32GAZAOTD-AAT TR is a 256 Gbit non-volatile flash memory device implemented as NAND SLC and organized as 32G × 8. It provides a UFS 2.1 memory interface and is intended for systems requiring compact, high-density flash in a BGA package.

Designed and qualified for automotive use, the device targets embedded applications that require extended temperature operation, UFS interface integration, and a narrow supply-voltage range for consistent system-level integration.

Key Features

  • Memory Type & Architecture — 256 Gbit FLASH NAND (SLC) organized as 32G × 8, providing high-density non-volatile storage in a single device.
  • Interface — UFS 2.1 memory interface for standard universal flash storage integration in host systems.
  • Clock — 52 MHz clock frequency support for the device interface timing.
  • Voltage — Wide supply-voltage range of 2.7 V to 3.6 V to match common system power rails.
  • Temperature & Qualification — Operating temperature range of −40°C to 105°C (TC) and AEC‑Q100 qualification for automotive-grade reliability.
  • Package — 153‑ball BGA package (153‑BGA) for compact mounting and board-level integration.

Typical Applications

  • Automotive storage systems — Automotive-grade flash storage for electronic control modules and infotainment systems where AEC‑Q100 qualification and extended temperature range are required.
  • Embedded UFS storage — Compact, high-density non-volatile memory for embedded platforms that implement a UFS 2.1 host interface.
  • Industrial electronics — Systems that require SLC NAND flash with a wide operating temperature range and a standardized UFS interface.

Unique Advantages

  • Automotive-qualified flash: AEC‑Q100 qualification indicates the device is specified for automotive use and extended temperature operation.
  • SLC NAND architecture: Single-level cell NAND provides the flash technology specified for the device.
  • Standard UFS 2.1 interface: Facilitates integration with hosts supporting Universal Flash Storage for consistent interface implementation.
  • Wide supply-voltage compatibility: 2.7 V to 3.6 V supply range aligns with common system power rails, simplifying power design.
  • Compact BGA footprint: 153‑BGA package enables high-density board integration while maintaining mechanical robustness.

Why Choose IC FLASH 256GBIT UFS?

The MTFC32GAZAOTD-AAT TR positions itself as a high-density, automotive-grade UFS storage device that combines SLC NAND technology with UFS 2.1 interface support and AEC‑Q100 qualification. Its specified operating range (−40°C to 105°C) and 2.7 V–3.6 V supply make it suitable for designs that require reliable non-volatile storage across demanding environmental conditions.

This device is appropriate for engineers and procurement teams specifying a compact 256 Gbit UFS flash component in automotive and industrial embedded systems where interface standardization, temperature tolerance, and package density are key selection criteria.

Request a quote or submit an inquiry to receive pricing, availability, and further technical assistance for the MTFC32GAZAOTD-AAT TR.

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