MTFC64GAPALBH-AIT ES TR

IC FLASH 512GBIT MMC 153TFBGA
Part Description

IC FLASH 512GBIT MMC 153TFBGA

Quantity 48 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-TFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size512 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltageN/AMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-TFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization64G x 8
Moisture Sensitivity Level1 (Unlimited)RoHS ComplianceN/AREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC64GAPALBH-AIT ES TR – IC FLASH 512GBIT MMC 153TFBGA

The MTFC64GAPALBH-AIT ES TR is an integrated e.MMC device combining a MultiMediaCard (MMC) controller with NAND flash memory in a 153-ball TFBGA package. It provides 512 Gbit of non-volatile NAND flash organized as 64G × 8 and communicates over an MMC interface compliant with JEDEC/MMC standard version 5.1.

Designed for embedded storage applications that require an on-board MMC controller, the device offers high-speed interface modes, secure storage features and field firmware update capability. The device is offered in an automotive-grade option with an operating temperature range of −40°C to +85°C.

Key Features

  • Integrated e.MMC architecture — Combines a MultiMediaCard controller with NAND flash to provide a single-chip embedded storage solution compliant with JEDEC/MMC 5.1.
  • Memory capacity and organization — 512 Gbit total capacity organized as 64G × 8 using NAND flash memory.
  • MMC interface and performance modes — Advanced 12-signal interface with selectable ×1, ×4, and ×8 I/Os; supports e.MMC I/F boot frequency up to 52 MHz and clock frequency up to 200 MHz, including HS200 and HS400 modes.
  • Power rails — Specifies VCC supply range 2.7–3.6V and VCCQ dual-voltage support at 1.70–1.95V and 2.7–3.6V.
  • Security and partitioning — Features replay-protected memory block (RPMB), multiple partitions with enhanced attributes, permanent and power-on write protection, and temporary write protection.
  • Data integrity and management — ECC and block management implemented, command queue support, BKOPS control, reliable write, and device health reporting.
  • System and boot features — High-speed boot operation, boot operation support, hardware reset signal, data strobe pin, high-priority interrupt (HPI), and sleep mode.
  • Serviceability and security — Field firmware update (FFU), discard and sanitize commands, power-off notification, and background operation support.
  • Package and temperature — 153-ball TFBGA package (11.5 mm × 13 mm × 1.1 mm) and operating temperature range −40°C to +85°C (AIT option).
  • Retention and qualification notes — Retention per AEC-Q100-005: 10 years @ 55°C at 10% of PE and 5 years @ 55°C at maximum PE; automotive-grade designation shown in product documentation.

Typical Applications

  • Automotive embedded storage — e.MMC device option and AEC-related retention statements support use in automotive embedded storage subsystems requiring integrated controller and NAND flash.
  • Embedded systems with JEDEC e.MMC interface — Provides a JEDEC/MMC 5.1-compliant MMC controller and NAND flash in a single package for compact embedded designs.
  • Secure storage and boot — RPMB, boot operation and write-protection features enable secure boot, authenticated storage, and protected data partitions.
  • Field-upgradeable products — Field firmware update (FFU) and background operation support make the device suitable for systems that require in-field firmware updates.

Unique Advantages

  • Integrated controller-plus-flash — Reduces system integration complexity by combining MMC controller functionality with NAND flash in a single e.MMC device.
  • Flexible interface options — Selectable ×1/×4/×8 I/O widths and support for HS200/HS400 and high boot clock frequencies enable adaptable performance for different host designs.
  • Security and partition management — RPMB, multiple partitions and permanent/power-on write protection provide hardware-level mechanisms for secure data storage and partition control.
  • Serviceability features — Field firmware update, device health reporting and reliable write support improve maintainability and lifecycle management.
  • Automotive-grade package and temperature option — Availability in a 153-ball TFBGA (11.5×13 mm) and a −40°C to +85°C AIT operating option supports deployment in temperature-challenging environments.
  • Data management and reliability — On-device ECC, block management, command queue and BKOPS control support sustained data integrity and background maintenance.

Why Choose IC FLASH 512GBIT MMC 153TFBGA?

The MTFC64GAPALBH-AIT ES TR provides a compact, JEDEC/MMC 5.1-compliant e.MMC solution that integrates an MMC controller with 512 Gbit of NAND flash, simplifying board-level storage design. Its feature set—including RPMB, FFU, ECC, and multiple I/O widths—addresses secure boot, in-field updates and robust data management requirements.

This device is suited for designs that require a fully integrated embedded storage component in a 153-ball TFBGA package with support for automotive-temperature operation. Retention specifications and automotive-designation information in the product documentation support long-term data retention planning for deployed systems.

Request a quote or submit an inquiry for pricing and availability for the MTFC64GAPALBH-AIT ES TR to evaluate it for your embedded storage requirements.

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