MTFC64GAPALBH-AIT ES TR
| Part Description |
IC FLASH 512GBIT MMC 153TFBGA |
|---|---|
| Quantity | 48 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-TFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 1 (Unlimited) | RoHS Compliance | N/A | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC64GAPALBH-AIT ES TR – IC FLASH 512GBIT MMC 153TFBGA
The MTFC64GAPALBH-AIT ES TR is an integrated e.MMC device combining a MultiMediaCard (MMC) controller with NAND flash memory in a 153-ball TFBGA package. It provides 512 Gbit of non-volatile NAND flash organized as 64G × 8 and communicates over an MMC interface compliant with JEDEC/MMC standard version 5.1.
Designed for embedded storage applications that require an on-board MMC controller, the device offers high-speed interface modes, secure storage features and field firmware update capability. The device is offered in an automotive-grade option with an operating temperature range of −40°C to +85°C.
Key Features
- Integrated e.MMC architecture — Combines a MultiMediaCard controller with NAND flash to provide a single-chip embedded storage solution compliant with JEDEC/MMC 5.1.
- Memory capacity and organization — 512 Gbit total capacity organized as 64G × 8 using NAND flash memory.
- MMC interface and performance modes — Advanced 12-signal interface with selectable ×1, ×4, and ×8 I/Os; supports e.MMC I/F boot frequency up to 52 MHz and clock frequency up to 200 MHz, including HS200 and HS400 modes.
- Power rails — Specifies VCC supply range 2.7–3.6V and VCCQ dual-voltage support at 1.70–1.95V and 2.7–3.6V.
- Security and partitioning — Features replay-protected memory block (RPMB), multiple partitions with enhanced attributes, permanent and power-on write protection, and temporary write protection.
- Data integrity and management — ECC and block management implemented, command queue support, BKOPS control, reliable write, and device health reporting.
- System and boot features — High-speed boot operation, boot operation support, hardware reset signal, data strobe pin, high-priority interrupt (HPI), and sleep mode.
- Serviceability and security — Field firmware update (FFU), discard and sanitize commands, power-off notification, and background operation support.
- Package and temperature — 153-ball TFBGA package (11.5 mm × 13 mm × 1.1 mm) and operating temperature range −40°C to +85°C (AIT option).
- Retention and qualification notes — Retention per AEC-Q100-005: 10 years @ 55°C at 10% of PE and 5 years @ 55°C at maximum PE; automotive-grade designation shown in product documentation.
Typical Applications
- Automotive embedded storage — e.MMC device option and AEC-related retention statements support use in automotive embedded storage subsystems requiring integrated controller and NAND flash.
- Embedded systems with JEDEC e.MMC interface — Provides a JEDEC/MMC 5.1-compliant MMC controller and NAND flash in a single package for compact embedded designs.
- Secure storage and boot — RPMB, boot operation and write-protection features enable secure boot, authenticated storage, and protected data partitions.
- Field-upgradeable products — Field firmware update (FFU) and background operation support make the device suitable for systems that require in-field firmware updates.
Unique Advantages
- Integrated controller-plus-flash — Reduces system integration complexity by combining MMC controller functionality with NAND flash in a single e.MMC device.
- Flexible interface options — Selectable ×1/×4/×8 I/O widths and support for HS200/HS400 and high boot clock frequencies enable adaptable performance for different host designs.
- Security and partition management — RPMB, multiple partitions and permanent/power-on write protection provide hardware-level mechanisms for secure data storage and partition control.
- Serviceability features — Field firmware update, device health reporting and reliable write support improve maintainability and lifecycle management.
- Automotive-grade package and temperature option — Availability in a 153-ball TFBGA (11.5×13 mm) and a −40°C to +85°C AIT operating option supports deployment in temperature-challenging environments.
- Data management and reliability — On-device ECC, block management, command queue and BKOPS control support sustained data integrity and background maintenance.
Why Choose IC FLASH 512GBIT MMC 153TFBGA?
The MTFC64GAPALBH-AIT ES TR provides a compact, JEDEC/MMC 5.1-compliant e.MMC solution that integrates an MMC controller with 512 Gbit of NAND flash, simplifying board-level storage design. Its feature set—including RPMB, FFU, ECC, and multiple I/O widths—addresses secure boot, in-field updates and robust data management requirements.
This device is suited for designs that require a fully integrated embedded storage component in a 153-ball TFBGA package with support for automotive-temperature operation. Retention specifications and automotive-designation information in the product documentation support long-term data retention planning for deployed systems.
Request a quote or submit an inquiry for pricing and availability for the MTFC64GAPALBH-AIT ES TR to evaluate it for your embedded storage requirements.