MTFC64GAPALBH-AAT ES TR

IC FLASH 512GBIT MMC 153TFBGA
Part Description

IC FLASH 512GBIT MMC 153TFBGA

Quantity 160 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time2 Weeks
Datasheet

Specifications & Environmental

Device Package153-TFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size512 GbitAccess TimeN/AGradeAutomotive
Clock FrequencyN/AVoltageN/AMemory TypeNon-Volatile
Operating Temperature-40°C ~ 105°C (TA)Write Cycle Time Word PageN/APackaging153-TFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization64G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC64GAPALBH-AAT ES TR – IC FLASH 512GBIT MMC 153TFBGA

The MTFC64GAPALBH-AAT ES TR is a 512 Gbit non-volatile NAND Flash memory device implemented as an e.MMC module. It combines NAND Flash with an MMC controller and implements the JEDEC/MMC Standard No. JESD84-B51 (version 5.1) interface for embedded storage.

Designed for embedded storage applications, this e.MMC device delivers high-density on-board memory in a 153-ball TFBGA (11.5 × 13 mm) package and supports extended operating temperatures to accommodate demanding environments.

Key Features

  • Memory Core 512 Gbit NAND Flash organized as 64G × 8, providing high-density non-volatile storage.
  • JEDEC e.MMC 5.1 Compliance Implements JEDEC/MMC standard version 5.1 (JESD84-B51) for standardized host interfacing and functionality.
  • Electrical Interface MMC interface with advanced 12-signal connectivity; selectable ×1, ×4, and ×8 I/Os. e.MMC I/F boot frequency 0–52 MHz and clock frequency 0–200 MHz.
  • High-speed Modes Supports HS200 and HS400 modes for higher throughput over the e.MMC interface.
  • Data Management & Security Built-in ECC and block management, command queue, reliable write, RPMB (replay-protected memory block), temporary and permanent write protection, and lock/card protection features.
  • System Features Boot operation (high-speed boot), field firmware update (FFU), device health report, background operation, power-off notification, discard and sanitize, and high-priority interrupt (HPI).
  • Power & Signal Options VCC range 2.7–3.6 V and VCCQ dual-voltage support 1.70–1.95 V or 2.7–3.6 V as specified in the product documentation.
  • Reliability & Retention ECC/block management plus specified retention guidance in the product documentation for long-term data retention.
  • Package & Temperature 153-ball TFBGA package (11.5 × 13 mm); operating temperature range −40°C to +105°C (TA).

Typical Applications

  • Automotive Embedded Storage On-board storage for automotive systems where an e.MMC form-factor and JEDEC e.MMC functionality are required.
  • Infotainment and Telematics High-density local storage for media, maps, and system data in vehicle infotainment and telematics units.
  • Embedded Data Logging Non-volatile logging and local data retention in embedded systems that require robust write protection and data management features.

Unique Advantages

  • High-density on-board storage: 512 Gbit capacity (64G × 8 organization) delivers substantial local storage without external memory expansion.
  • Standards-based interface: JEDEC/MMC 5.1 compliance ensures compatibility with hosts designed to the JESD84-B51 specification.
  • Flexible I/O and performance modes: Selectable ×1/×4/×8 I/Os and HS200/HS400 support accommodate varying throughput and host capability requirements.
  • Integrated data integrity features: ECC, block management, reliable write, and RPMB support help protect data and simplify system-level error handling.
  • Automotive-grade specification: Documented automotive-grade attributes in the product literature, together with wide temperature operation (−40°C to +105°C), support use in demanding environments.
  • Compact package: 153-ball TFBGA (11.5 × 13 mm) provides a small footprint for space-constrained designs.

Why Choose IC FLASH 512GBIT MMC 153TFBGA?

The MTFC64GAPALBH-AAT ES TR provides a standards-compliant e.MMC solution that combines high-density NAND Flash with an embedded MMC controller and a broad set of data management and security features. Its compact 153-ball TFBGA package and extended temperature range make it suitable for embedded systems requiring robust onboard storage and reliable data handling.

This device is well suited for designers and developers who need a high-capacity, JEDEC-compliant e.MMC memory module with integrated features for boot, secure storage, and background maintenance, delivering a scalable storage option for embedded and automotive-grade applications.

Request a quote or submit an inquiry to our sales team for pricing, availability, and lead-time information on the MTFC64GAPALBH-AAT ES TR IC FLASH 512GBIT MMC 153TFBGA.

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