MTFC64GAPALBH-AIT ES

IC FLASH 512GBIT MMC 153TFBGA
Part Description

IC FLASH 512GBIT MMC 153TFBGA

Quantity 1,297 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-TFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size512 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltageN/AMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-TFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization64G x 8
Moisture Sensitivity Level1 (Unlimited)RoHS ComplianceUnknownREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC64GAPALBH-AIT ES – IC FLASH 512GBIT MMC 153TFBGA

The MTFC64GAPALBH-AIT ES is a 512 Gbit e.MMC memory device combining a MultiMediaCard controller and NAND flash in a single package. It implements the e•MMC architecture and JEDEC/MMC standard version 5.1-compliant feature set for embedded non-volatile storage.

This device targets embedded systems and automotive-grade applications that require high-density, managed flash storage with features such as boot operation, partitions, secure replay-protected memory (RPMB), and field firmware update support.

Key Features

  • Core MultiMediaCard controller integrated with NAND flash; JEDEC/MMC standard version 5.1-compliant.
  • Memory 512 Gbit total capacity organized as 64G × 8, implemented with NAND flash memory.
  • Interface and Performance Modes e.MMC interface supporting ×1, ×4, and ×8 I/Os (host-selectable); e.MMC I/F boot frequency up to 52 MHz and clock frequency up to 200 MHz; HS200/HS400 modes supported.
  • Power Domains VCC: 2.7–3.6 V; VCCQ (dual voltage): 1.70–1.95 V or 2.7–3.6 V as supported by device options.
  • System Reliability and Security ECC and block management implemented; reliable write, temporary/permanent write protection, RPMB, command queue, and device health report features.
  • Boot and Maintenance Boot operation (high-speed boot), field firmware update (FFU), sleep mode, background operation, and power-off notification.
  • Command and Management Features Support for command classes including block read/write, erase, write protection, lock card, BKOPS control, discard and sanitize, and high-priority interrupt (HPI).
  • Package and Temperature 153-ball TFBGA package (11.5 mm × 13 mm × 1.1 mm) and specified operating temperature range of −40°C to +85°C (TA) for the AIT option.
  • Automotive-Grade Capability Automotive-grade designation in the datasheet (AEC-Q104) and retention compliance (AEC-Q100-005) with retention characteristics specified in the datasheet.

Typical Applications

  • Automotive Embedded Storage Persistent storage for automotive systems where e.MMC features such as boot operation, RPMB and device health report are required.
  • System Boot and Firmware Storage Host boot and field firmware update storage using the device's high-speed boot operation and FFU capability.
  • Industrial Embedded Systems High-density managed NAND storage for embedded controllers and appliances operating within −40°C to +85°C.

Unique Advantages

  • Standards-compliant e.MMC solution: JEDEC/MMC 5.1 compliance simplifies host integration and leverages a defined MMC feature set.
  • High-density managed storage: 512 Gbit (64G × 8) capacity provides substantial onboard non-volatile storage in a single device.
  • Flexible interface and performance modes: Selectable ×1/×4/×8 I/Os and support for HS200/HS400 modes accommodate varying host performance needs.
  • Built-in data integrity and security: ECC, block management, RPMB, reliable write and write-protection features reduce software overhead for data reliability.
  • Automotive-grade options and retention data: AEC-Q104 designation and retention compliance details in the datasheet support use in applications with defined retention requirements.
  • Compact, industry-standard package: 153-ball TFBGA (11.5 × 13 mm) provides a compact footprint for space-constrained designs.

Why Choose IC FLASH 512GBIT MMC 153TFBGA?

The MTFC64GAPALBH-AIT ES positions itself as a high-density, managed e.MMC storage device that balances integration and system-level reliability. Its JEDEC-compliant interface, built-in ECC/block management, secure RPMB functionality, and firmware update capabilities make it suitable for embedded designs requiring handled NAND behavior and system-level storage features.

This device is appropriate for designers of automotive and industrial embedded systems that need durable non-volatile storage with defined operating temperature support and compact packaging. The inclusion of automotive-grade designations and retention specifications supports long-term deployment planning and lifecycle considerations outlined in the datasheet.

Request a quote or submit an inquiry to obtain availability, pricing, and additional technical information for the MTFC64GAPALBH-AIT ES.

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