MTFC64GAPALBH-AIT ES
| Part Description |
IC FLASH 512GBIT MMC 153TFBGA |
|---|---|
| Quantity | 1,297 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-TFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 1 (Unlimited) | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC64GAPALBH-AIT ES – IC FLASH 512GBIT MMC 153TFBGA
The MTFC64GAPALBH-AIT ES is a 512 Gbit e.MMC memory device combining a MultiMediaCard controller and NAND flash in a single package. It implements the e•MMC architecture and JEDEC/MMC standard version 5.1-compliant feature set for embedded non-volatile storage.
This device targets embedded systems and automotive-grade applications that require high-density, managed flash storage with features such as boot operation, partitions, secure replay-protected memory (RPMB), and field firmware update support.
Key Features
- Core MultiMediaCard controller integrated with NAND flash; JEDEC/MMC standard version 5.1-compliant.
- Memory 512 Gbit total capacity organized as 64G × 8, implemented with NAND flash memory.
- Interface and Performance Modes e.MMC interface supporting ×1, ×4, and ×8 I/Os (host-selectable); e.MMC I/F boot frequency up to 52 MHz and clock frequency up to 200 MHz; HS200/HS400 modes supported.
- Power Domains VCC: 2.7–3.6 V; VCCQ (dual voltage): 1.70–1.95 V or 2.7–3.6 V as supported by device options.
- System Reliability and Security ECC and block management implemented; reliable write, temporary/permanent write protection, RPMB, command queue, and device health report features.
- Boot and Maintenance Boot operation (high-speed boot), field firmware update (FFU), sleep mode, background operation, and power-off notification.
- Command and Management Features Support for command classes including block read/write, erase, write protection, lock card, BKOPS control, discard and sanitize, and high-priority interrupt (HPI).
- Package and Temperature 153-ball TFBGA package (11.5 mm × 13 mm × 1.1 mm) and specified operating temperature range of −40°C to +85°C (TA) for the AIT option.
- Automotive-Grade Capability Automotive-grade designation in the datasheet (AEC-Q104) and retention compliance (AEC-Q100-005) with retention characteristics specified in the datasheet.
Typical Applications
- Automotive Embedded Storage Persistent storage for automotive systems where e.MMC features such as boot operation, RPMB and device health report are required.
- System Boot and Firmware Storage Host boot and field firmware update storage using the device's high-speed boot operation and FFU capability.
- Industrial Embedded Systems High-density managed NAND storage for embedded controllers and appliances operating within −40°C to +85°C.
Unique Advantages
- Standards-compliant e.MMC solution: JEDEC/MMC 5.1 compliance simplifies host integration and leverages a defined MMC feature set.
- High-density managed storage: 512 Gbit (64G × 8) capacity provides substantial onboard non-volatile storage in a single device.
- Flexible interface and performance modes: Selectable ×1/×4/×8 I/Os and support for HS200/HS400 modes accommodate varying host performance needs.
- Built-in data integrity and security: ECC, block management, RPMB, reliable write and write-protection features reduce software overhead for data reliability.
- Automotive-grade options and retention data: AEC-Q104 designation and retention compliance details in the datasheet support use in applications with defined retention requirements.
- Compact, industry-standard package: 153-ball TFBGA (11.5 × 13 mm) provides a compact footprint for space-constrained designs.
Why Choose IC FLASH 512GBIT MMC 153TFBGA?
The MTFC64GAPALBH-AIT ES positions itself as a high-density, managed e.MMC storage device that balances integration and system-level reliability. Its JEDEC-compliant interface, built-in ECC/block management, secure RPMB functionality, and firmware update capabilities make it suitable for embedded designs requiring handled NAND behavior and system-level storage features.
This device is appropriate for designers of automotive and industrial embedded systems that need durable non-volatile storage with defined operating temperature support and compact packaging. The inclusion of automotive-grade designations and retention specifications supports long-term deployment planning and lifecycle considerations outlined in the datasheet.
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