MTFC64GAPALBH-AAT

The MTFC64GAPALBH-AAT is a 512 Gbit non-volatile NAND Flash memory device implemented as an e.MMC (MMC) module combining a MultiMediaCard controller with NAND Flash. It provides organized flash storage (64G × 8) in a 153-ball TFBGA package (11.5 × 13 mm) for embedded storage applications that require an MMC interface.

Designed with e.MMC architecture and a broad operating temperature range, the device targets embedded and system storage use cases where integrated flash management, boot capability and multiple partition support are required.

Key Features

• Memory Type and Capacity — 512 Gbit NAND Flash organized as 64G × 8, providing high-density non-volatile storage in a single e.MMC component.
• e.MMC Interface and Standards — JEDEC/MMC standard version 5.1-compliant; supports ×1, ×4 and ×8 I/Os selectable by host, with e.MMC I/F boot frequency 0–52 MHz and clock frequency 0–200 MHz.
• Advanced I/O and Modes — Advanced 12-signal interface with support for HS200 and HS400 modes and a data strobe pin for high-speed transfers.
• System and Data Management — Integrated MMC controller features command classes (read/write/erase/protection/lock), command queue, ECC and block management, reliable write, discard and sanitize functions, and field firmware update (FFU).
• Security and Partitioning — Support for Replay-Protected Memory Block (RPMB), multiple partitions with enhanced attributes, permanent and power-on write protection, temporary write protection and high-priority interrupt (HPI).
• Power and Background Operations — Sleep mode, power-off notification, background operation and BKOPS control to manage internal maintenance tasks and power states.
• Electrical — VCC: 2.7–3.6 V; VCCQ (dual voltage): 1.70–1.95 V or 2.7–3.6 V as documented in the device specification.
• Package and Temperature — 153-ball TFBGA package (11.5 × 13 mm); operating temperature range −40°C to +105°C (TA).
• Automotive-grade Options — Documented AEC qualification reference (AEC-Q104) and related retention qualifications noted in the product datasheet.

Typical Applications

• Embedded Storage Systems — Primary flash storage for embedded devices that require MMC/e.MMC interface, partitioning and secure RPMB regions.
• Boot and Firmware Storage — High-speed boot operation and field firmware update (FFU) support for systems that require reliable firmware storage and update capability.
• Industrial and Harsh-Environment Electronics — Non-volatile NAND Flash storage with a wide operating temperature range (−40°C to +105°C) for industrial applications.
• Systems Requiring Integrated Flash Management — Designs that benefit from on-module ECC, block management, command queue and background maintenance functions to reduce host-side flash management complexity.

Unique Advantages

• Integrated Controller and NAND — Combines MMC controller and NAND Flash in one module to simplify system integration and reduce BOM complexity.
• Standards Compliance — JEDEC/MMC 5.1 compliance ensures defined behavior and interoperability with hosts that support the standard MMC/e.MMC feature set.
• Flexible Interface Options — Selectable ×1/×4/×8 I/Os and broad clock ranges provide flexibility for different performance and pin-count requirements.
• Comprehensive Data Management — Built-in ECC, block management, command queue and reliable write capabilities reduce firmware development burden on the host.
• Wide Temperature Range — −40°C to +105°C operating range supports deployment in applications with extended thermal requirements.
• Automotive-grade Qualification References — Datasheet documents AEC-related qualification information for customers evaluating higher-reliability use cases.

Why Choose MTFC64GAPALBH-AAT?

The MTFC64GAPALBH-AAT delivers high-density 512 Gbit NAND Flash storage with an integrated MMC controller and a comprehensive set of e.MMC features—addressing boot capability, partitioning, secure RPMB, and robust data management on-module. Its JEDEC 5.1 compliance, selectable I/O widths and defined electrical interfaces make it suitable for designs that require standardized MMC storage behavior and flexible performance scaling.

With a 153-ball TFBGA package and an extended operating temperature range, this device is positioned for embedded and industrial applications that need compact, managed flash storage and documented qualification references for higher-reliability requirements.

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