MTFC64GAPAKEA-WT ES TR
| Part Description |
IC FLASH 512GBIT MMC 153WFBGA |
|---|---|
| Quantity | 306 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-WFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -25°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-WFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 1 (Unlimited) | RoHS Compliance | N/A | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC64GAPAKEA-WT ES TR – IC FLASH 512GBIT MMC 153WFBGA
The MTFC64GAPAKEA-WT ES TR is a non-volatile NAND flash memory device in Micron Technology Inc.'s e•MMC series. It provides 512 Gbit of flash organized as 64G × 8 and communicates over an MMC memory interface.
This device is supplied in a compact 153-WFBGA package (11.5 × 13 mm) and is specified for operation from −25°C to 85°C, making it suited to designs that require high-density MMC-format storage within a small board footprint and a defined ambient temperature range.
Key Features
- Memory Type & Technology Non-volatile FLASH memory using NAND technology for persistent storage.
- Capacity & Organization 512 Gbit capacity organized as 64G × 8 to support high-density storage requirements.
- Interface MMC memory interface for integration into MMC-compatible host systems.
- Package 153-WFBGA package; supplier device package specified as 153-WFBGA (11.5 × 13 mm) for compact board-level integration.
- Operating Temperature Specified ambient operating range of −25°C to 85°C for use within that temperature window.
- Series and Manufacturer Part of Micron Technology Inc.'s e•MMC series.
Typical Applications
- MMC-based embedded systems — Use as on-board non-volatile storage where an MMC interface is required for data storage and retrieval.
- High-density storage modules — Suitable for designs that require 512 Gbit of NAND flash in a compact package (153-WFBGA, 11.5 × 13 mm).
- Temperature-constrained electronics — Appropriate for assemblies operating within the specified −25°C to 85°C ambient range.
Unique Advantages
- High storage density: 512 Gbit capacity provides substantial non-volatile storage in a single device.
- Standard MMC interface: MMC memory interface enables integration with MMC-compatible hosts and controllers.
- Compact package footprint: 153-WFBGA (11.5 × 13 mm) offers a small board area for high-capacity storage implementations.
- Broad ambient temperature range: Rated for −25°C to 85°C to match systems with defined temperature requirements.
- Produced by a known manufacturer: Part of Micron Technology Inc.'s e•MMC series, providing clear manufacturer sourcing.
Why Choose MTFC64GAPAKEA-WT ES TR?
The MTFC64GAPAKEA-WT ES TR combines 512 Gbit of NAND flash density with an MMC interface and a compact 153-WFBGA package, addressing designs that need substantial non-volatile storage in a small footprint. Its −25°C to 85°C operating range and e•MMC series designation align it with systems that require MMC-format storage with defined ambient temperature limits.
This device is suited for engineers specifying high-capacity MMC-based memory where package size, capacity, and a known manufacturer identity are primary selection criteria.
Request a quote or submit an inquiry to receive pricing and availability information for the MTFC64GAPAKEA-WT ES TR.
