MTFC64GAKAEYF-4M IT

IC FLASH 512GBIT MMC 153LFBGA
Part Description

IC FLASH 512GBIT MMC 153LFBGA

Quantity 881 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-LFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size512 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltageN/AMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-LFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization64G x 8
Moisture Sensitivity LevelN/ARoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC64GAKAEYF-4M IT – IC FLASH 512GBIT MMC 153LFBGA

The MTFC64GAKAEYF-4M IT is a 512 Gbit (64G × 8) e.MMC memory device integrating a MultiMediaCard controller with NAND flash. It implements the MMC interface and JEDEC/MMC Standard No. JESD84-B50 (v5.0) features to provide embedded non-volatile storage in a compact BGA package.

Designed for applications requiring high-density, managed flash storage, the device delivers multi-mode MMC bus support (SDR/DDR, HS200/HS400) and on-device block management and ECC for simplified system integration and reliable data storage across an ambient operating range of –40°C to +85°C.

Key Features

  • Integrated e.MMC architecture — MMC controller plus NAND flash in a single device for managed, non-volatile storage.
  • Memory capacity & organization — 512 Gbit total organized as 64G × 8 for high-density embedded storage.
  • JEDEC-compliant MMC interface — Conforms to JEDEC/MMC standard version 5.0 with advanced 12-signal interface; supports x1, x4 and x8 I/Os selectable by the host.
  • High-speed bus modes — Supports SDR/DDR up to 52 MHz, HS200 and HS400 modes; typical HS400 sequential read up to 280 MB/s and sequential write up to 50 MB/s (64GB device data).
  • Random I/O performance — Typical random read and write performance figures provided for system planning (example: random read up to ~4700 IOPS, random write up to ~5800 IOPS with cache on for the 64GB device).
  • Power supply ranges — VCC: 2.7–3.6V; VCCQ (dual voltage): 1.65–1.95V or 2.7–3.6V as supported by device variants.
  • Data management & security — On-device ECC and block management, Replay-Protected Memory Block (RPMB), secure erase/trim, temporary and power-on write protection, and lock/partitioning features.
  • System features — Boot operation (including high-speed boot), sleep mode, hardware reset signal, high-priority interrupt (HPI), background operation, reliable write and device health report.
  • Field maintainability — Field firmware update (FFU) support and device health reporting for in-field servicing and firmware maintenance.
  • Package and temperature — 153-ball LFBGA package (11.5 × 13 mm); ambient operating temperature range –40°C to +85°C. RoHS-compliant package variants are documented in the device family.

Typical Applications

  • Embedded system boot and storage — High-density managed flash with high-speed boot capability suited for system firmware and OS storage.
  • Secure data storage — RPMB, secure erase and partitioning features enable protected storage and secure data handling in embedded systems.
  • Field-updatable devices — Field firmware update and device health reporting support in-field maintenance and firmware management.
  • Industrial and temperature-sensitive designs — Operation across –40°C to +85°C to support ambient temperature ranges found in industrial applications.

Unique Advantages

  • High-density, integrated storage: 512 Gbit in a single package reduces board-level component count for compact designs.
  • Standards-based interface: JEDEC/MMC v5.0 compliance and multiple I/O widths (x1/x4/x8) simplify host integration and interoperability.
  • High-speed throughput: HS200/HS400 support and documented sequential and random performance figures help meet system-level performance requirements.
  • On-device data integrity and security: Built-in ECC, block management, RPMB and secure erase features lower firmware complexity and improve data protection.
  • Field serviceability: Field firmware update (FFU) and device health reporting ease long-term maintenance and lifecycle management.
  • Robust operating range and package: 153-LFBGA (11.5 × 13 mm) package and –40°C to +85°C ambient rating address a range of embedded and industrial environments.

Why Choose MTFC64GAKAEYF-4M IT?

The MTFC64GAKAEYF-4M IT positions itself as a high-density, standards-compliant e.MMC solution that integrates NAND flash and a MMC controller to simplify embedded storage design. Its combination of HS200/HS400 bus modes, documented throughput and random I/O figures, on-device ECC/block management and security features make it suitable for designs that need managed, reliable non-volatile storage with field update capability.

This device is well suited for engineers designing embedded systems that require compact, high-capacity storage with secure partitioning and broad operating temperature support. The integrated feature set reduces host firmware complexity and supports long-term maintenance through field firmware updates and device health reporting.

Request a quote or submit an inquiry for pricing and availability to evaluate the MTFC64GAKAEYF-4M IT for your next embedded storage design.

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