MTFC64GAKAEYF-4M IT
| Part Description |
IC FLASH 512GBIT MMC 153LFBGA |
|---|---|
| Quantity | 881 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-LFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-LFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC64GAKAEYF-4M IT – IC FLASH 512GBIT MMC 153LFBGA
The MTFC64GAKAEYF-4M IT is a 512 Gbit (64G × 8) e.MMC memory device integrating a MultiMediaCard controller with NAND flash. It implements the MMC interface and JEDEC/MMC Standard No. JESD84-B50 (v5.0) features to provide embedded non-volatile storage in a compact BGA package.
Designed for applications requiring high-density, managed flash storage, the device delivers multi-mode MMC bus support (SDR/DDR, HS200/HS400) and on-device block management and ECC for simplified system integration and reliable data storage across an ambient operating range of –40°C to +85°C.
Key Features
- Integrated e.MMC architecture — MMC controller plus NAND flash in a single device for managed, non-volatile storage.
- Memory capacity & organization — 512 Gbit total organized as 64G × 8 for high-density embedded storage.
- JEDEC-compliant MMC interface — Conforms to JEDEC/MMC standard version 5.0 with advanced 12-signal interface; supports x1, x4 and x8 I/Os selectable by the host.
- High-speed bus modes — Supports SDR/DDR up to 52 MHz, HS200 and HS400 modes; typical HS400 sequential read up to 280 MB/s and sequential write up to 50 MB/s (64GB device data).
- Random I/O performance — Typical random read and write performance figures provided for system planning (example: random read up to ~4700 IOPS, random write up to ~5800 IOPS with cache on for the 64GB device).
- Power supply ranges — VCC: 2.7–3.6V; VCCQ (dual voltage): 1.65–1.95V or 2.7–3.6V as supported by device variants.
- Data management & security — On-device ECC and block management, Replay-Protected Memory Block (RPMB), secure erase/trim, temporary and power-on write protection, and lock/partitioning features.
- System features — Boot operation (including high-speed boot), sleep mode, hardware reset signal, high-priority interrupt (HPI), background operation, reliable write and device health report.
- Field maintainability — Field firmware update (FFU) support and device health reporting for in-field servicing and firmware maintenance.
- Package and temperature — 153-ball LFBGA package (11.5 × 13 mm); ambient operating temperature range –40°C to +85°C. RoHS-compliant package variants are documented in the device family.
Typical Applications
- Embedded system boot and storage — High-density managed flash with high-speed boot capability suited for system firmware and OS storage.
- Secure data storage — RPMB, secure erase and partitioning features enable protected storage and secure data handling in embedded systems.
- Field-updatable devices — Field firmware update and device health reporting support in-field maintenance and firmware management.
- Industrial and temperature-sensitive designs — Operation across –40°C to +85°C to support ambient temperature ranges found in industrial applications.
Unique Advantages
- High-density, integrated storage: 512 Gbit in a single package reduces board-level component count for compact designs.
- Standards-based interface: JEDEC/MMC v5.0 compliance and multiple I/O widths (x1/x4/x8) simplify host integration and interoperability.
- High-speed throughput: HS200/HS400 support and documented sequential and random performance figures help meet system-level performance requirements.
- On-device data integrity and security: Built-in ECC, block management, RPMB and secure erase features lower firmware complexity and improve data protection.
- Field serviceability: Field firmware update (FFU) and device health reporting ease long-term maintenance and lifecycle management.
- Robust operating range and package: 153-LFBGA (11.5 × 13 mm) package and –40°C to +85°C ambient rating address a range of embedded and industrial environments.
Why Choose MTFC64GAKAEYF-4M IT?
The MTFC64GAKAEYF-4M IT positions itself as a high-density, standards-compliant e.MMC solution that integrates NAND flash and a MMC controller to simplify embedded storage design. Its combination of HS200/HS400 bus modes, documented throughput and random I/O figures, on-device ECC/block management and security features make it suitable for designs that need managed, reliable non-volatile storage with field update capability.
This device is well suited for engineers designing embedded systems that require compact, high-capacity storage with secure partitioning and broad operating temperature support. The integrated feature set reduces host firmware complexity and supports long-term maintenance through field firmware updates and device health reporting.
Request a quote or submit an inquiry for pricing and availability to evaluate the MTFC64GAKAEYF-4M IT for your next embedded storage design.