MTFC64GAPAKEA-WT ES

IC FLASH 512GBIT MMC 153WFBGA
Part Description

IC FLASH 512GBIT MMC 153WFBGA

Quantity 1,147 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-WFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size512 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltageN/AMemory TypeNon-Volatile
Operating Temperature-25°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-WFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization64G x 8
Moisture Sensitivity Level1 (Unlimited)RoHS ComplianceN/AREACH ComplianceREACH Unknown
QualificationN/AECCNOBSOLETEHTS CodeN/A

Overview of MTFC64GAPAKEA-WT ES – IC FLASH 512GBIT MMC 153WFBGA

The MTFC64GAPAKEA-WT ES is a non-volatile flash memory device in Micron's e•MMC™ series, implemented with NAND flash technology. It provides 512 Gbit of storage arranged as 64G × 8 and uses an MMC memory interface for embedded storage integration.

This device is suited for designs that require high-density, non-volatile memory in a compact 153-WFBGA package and that operate across an ambient temperature range of -25°C to 85°C.

Key Features

  • Memory Technology NAND flash non-volatile memory provides persistent storage suitable for MMC-based systems.
  • Memory Capacity & Organization 512 Gbit total capacity organized as 64G × 8 for straightforward addressing and allocation.
  • Interface MMC memory interface for integration with systems designed to use MMC protocol storage.
  • Package 153-WFBGA package (153-WFBGA, 11.5x13) offering a compact surface-mount form factor.
  • Operating Temperature Specified ambient operating range of -25°C to 85°C (TA), supporting a wide range of environmental conditions.
  • Series Part of the e•MMC™ series, identified as an IC FLASH 512GBIT MMC 153WFBGA device.

Typical Applications

  • Embedded Storage Systems that require high-density non-volatile storage via an MMC interface for firmware and data retention.
  • Industrial Equipment Control and instrumentation applications operating within the device's -25°C to 85°C ambient range.
  • MMC-Based Systems Designs and products that integrate MMC interface memory for on-board or module storage solutions.

Unique Advantages

  • High Density Capacity: 512 Gbit of NAND flash provides substantial on-board storage for data and code.
  • MMC Interface Compatibility: Native MMC interface simplifies integration into MMC-capable host designs.
  • Compact 153-WFBGA Package: Surface-mount 153-WFBGA package (11.5x13) enables space-efficient board layouts.
  • Wide Operating Range: Rated for -25°C to 85°C ambient operation, covering many commercial and industrial environments.
  • e•MMC™ Series Identification: Clear series designation for designers specifying e•MMC™ class flash memory.

Why Choose IC FLASH 512GBIT MMC 153WFBGA?

The MTFC64GAPAKEA-WT ES combines high-density NAND flash storage with an MMC interface in a compact 153-WFBGA package, making it a practical choice for embedded systems that require substantial non-volatile memory. Its specified organization and capacity support straightforward memory allocation for firmware, file systems, and data storage.

This device is appropriate for designs and teams prioritizing integration of e•MMC™-style storage where package footprint, capacity, and ambient operating range are key selection criteria. It offers a clear, verifiable spec set for procurement and system-level planning.

Request a quote or contact sales to discuss pricing, availability, and lead time for MTFC64GAPAKEA-WT ES. Submit your requirements to receive a formal quote tailored to your project.

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