MTFC64GAPAKEA-WT ES
| Part Description |
IC FLASH 512GBIT MMC 153WFBGA |
|---|---|
| Quantity | 1,147 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-WFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -25°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-WFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 1 (Unlimited) | RoHS Compliance | N/A | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | OBSOLETE | HTS Code | N/A |
Overview of MTFC64GAPAKEA-WT ES – IC FLASH 512GBIT MMC 153WFBGA
The MTFC64GAPAKEA-WT ES is a non-volatile flash memory device in Micron's e•MMC™ series, implemented with NAND flash technology. It provides 512 Gbit of storage arranged as 64G × 8 and uses an MMC memory interface for embedded storage integration.
This device is suited for designs that require high-density, non-volatile memory in a compact 153-WFBGA package and that operate across an ambient temperature range of -25°C to 85°C.
Key Features
- Memory Technology NAND flash non-volatile memory provides persistent storage suitable for MMC-based systems.
- Memory Capacity & Organization 512 Gbit total capacity organized as 64G × 8 for straightforward addressing and allocation.
- Interface MMC memory interface for integration with systems designed to use MMC protocol storage.
- Package 153-WFBGA package (153-WFBGA, 11.5x13) offering a compact surface-mount form factor.
- Operating Temperature Specified ambient operating range of -25°C to 85°C (TA), supporting a wide range of environmental conditions.
- Series Part of the e•MMC™ series, identified as an IC FLASH 512GBIT MMC 153WFBGA device.
Typical Applications
- Embedded Storage Systems that require high-density non-volatile storage via an MMC interface for firmware and data retention.
- Industrial Equipment Control and instrumentation applications operating within the device's -25°C to 85°C ambient range.
- MMC-Based Systems Designs and products that integrate MMC interface memory for on-board or module storage solutions.
Unique Advantages
- High Density Capacity: 512 Gbit of NAND flash provides substantial on-board storage for data and code.
- MMC Interface Compatibility: Native MMC interface simplifies integration into MMC-capable host designs.
- Compact 153-WFBGA Package: Surface-mount 153-WFBGA package (11.5x13) enables space-efficient board layouts.
- Wide Operating Range: Rated for -25°C to 85°C ambient operation, covering many commercial and industrial environments.
- e•MMC™ Series Identification: Clear series designation for designers specifying e•MMC™ class flash memory.
Why Choose IC FLASH 512GBIT MMC 153WFBGA?
The MTFC64GAPAKEA-WT ES combines high-density NAND flash storage with an MMC interface in a compact 153-WFBGA package, making it a practical choice for embedded systems that require substantial non-volatile memory. Its specified organization and capacity support straightforward memory allocation for firmware, file systems, and data storage.
This device is appropriate for designs and teams prioritizing integration of e•MMC™-style storage where package footprint, capacity, and ambient operating range are key selection criteria. It offers a clear, verifiable spec set for procurement and system-level planning.
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