MTFC64GAPALBH-AAT ES
| Part Description |
IC FLASH 512GBIT MMC 153TFBGA |
|---|---|
| Quantity | 1,566 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 2 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 153-TFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC64GAPALBH-AAT ES – IC FLASH 512GBIT MMC 153TFBGA
The MTFC64GAPALBH-AAT ES is a 512 Gbit e.MMC memory device integrating an MMC host controller with NAND Flash storage. It implements a JEDEC/MMC 5.1-compliant architecture with built-in NAND management and interface features for embedded storage applications.
Designed for systems requiring high-density non-volatile storage, the device targets embedded and automotive-grade applications where integrated boot capability, secure partitions, and extended temperature operation are required.
Key Features
- Core Architecture Integrated MultiMediaCard (MMC) controller and NAND Flash providing a single-package flash memory solution.
- Memory 512 Gbit capacity organized as 64G × 8 (FLASH - NAND) to deliver high-density non-volatile storage.
- Standards & Interface JEDEC/MMC standard version 5.1-compliant with an advanced 12-signal interface and selectable ×1, ×4, and ×8 I/Os; e.MMC I/F clock up to 200 MHz and boot frequency up to 52 MHz.
- High-Speed Modes Supports HS200 and HS400 modes for higher throughput where supported by the host.
- System & Data Management ECC and block management are implemented on-device; features include command queue, BKOPS control, reliable write, discard and sanitize, and temporary/permanent write protection.
- Security & Boot Supports Replay-Protected Memory Block (RPMB), multiple partitions with enhanced attributes, high-priority interrupt (HPI), boot operation (high-speed boot), and hardware reset signal.
- Maintainability Field firmware update (FFU), device health report, background operation, and power-off notification for system-level reliability and maintainability.
- Power & Voltage Supports VCC 2.7–3.6V and dual VCCQ options of 1.70–1.95V or 2.7–3.6V as detailed in the device specification.
- Package & Temperature 153-ball TFBGA package (11.5 × 13 mm) with an operating temperature range of −40°C to +105°C (TA).
- Automotive Grade Automotive-grade optioning is identified in the product documentation, including references to AEC specifications and retention compliance details.
Typical Applications
- Automotive systems Embedded storage and boot media for in-vehicle systems that require automotive-grade e.MMC features and extended temperature operation.
- Embedded devices Integrated non-volatile storage for embedded controllers and appliances that benefit from an on-board MMC controller and NAND management.
- Boot media High-density boot partitions and secure boot storage using the device’s boot operation and RPMB support.
- Secure/Managed Storage Applications requiring replay-protection, partition management, and device health reporting for lifecycle monitoring.
Unique Advantages
- Integrated MMC controller and NAND Reduces BOM and simplifies board-level integration by combining controller and NAND Flash in a single package.
- JEDEC/MMC 5.1 compliance Ensures a standardized e.MMC interface and feature set for interoperability with hosts supporting the standard.
- High-density storage 512 Gbit capacity (64G × 8) provides substantial non-volatile storage in a compact TFBGA package.
- Extended temperature range Rated for −40°C to +105°C (TA), supporting designs that require wider operating conditions.
- On-device reliability features Built-in ECC, block management, reliable write, BKOPS control, and device health reporting improve data integrity and maintenance visibility.
- Boot and security features High-speed boot, RPMB, and multiple partition support enable secure boot and protected storage use cases.
Why Choose IC FLASH 512GBIT MMC 153TFBGA?
The MTFC64GAPALBH-AAT ES combines high-density NAND Flash with a JEDEC-compliant e.MMC controller to deliver a compact, integrated storage solution suited to embedded and automotive-influenced designs. Its combination of high capacity, on-device ECC and management, and boot/security features addresses applications that need reliable non-volatile storage with simplified system integration.
This device is appropriate for engineers and procurement sourcing robust, high-capacity e.MMC memory in a 153-TFBGA package operating across −40°C to +105°C. Retention and automotive-grade references in the specification support long-term data integrity and use in demanding environments.
Request a quote or contact sales to discuss availability, lead times, and qualification options for the MTFC64GAPALBH-AAT ES.
