MTFC64GAPALBH-AIT

IC FLASH 512GBIT MMC 153TFBGA
Part Description

IC FLASH 512GBIT MMC 153TFBGA

Quantity 1,544 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-TFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size512 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltageN/AMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-TFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization64G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC64GAPALBH-AIT – IC FLASH 512GBIT MMC 153TFBGA

The MTFC64GAPALBH-AIT is a 512 Gbit e.MMC memory device that integrates a MultiMediaCard (MMC) controller with NAND flash. It implements JEDEC/MMC standard version 5.1 functionality and supports advanced interface options for embedded storage.

Targeted at embedded and automotive-capable designs, the device offers multi-I/O modes, high-speed interface options, and on-device management features to simplify system integration while supporting extended temperature operation from −40°C to +85°C.

Key Features

  • Memory and Technology 512 Gbit NAND flash organized as 64G × 8, provided in e.MMC format for single-component embedded storage.
  • Standards and Interface JEDEC/MMC standard version 5.1-compliant with an advanced 12-signal interface; selectable ×1, ×4 and ×8 I/Os and e.MMC interface clock rates up to 200 MHz (boot frequency up to 52 MHz).
  • High-Speed Modes Supports HS200 and HS400 modes for high-throughput data transfer when paired with compatible hosts.
  • Power and Voltage Device VCC range 2.7–3.6 V with VCCQ dual-voltage options of 1.70–1.95 V and 2.7–3.6 V.
  • System Reliability and Data Protection On-device ECC and block management, reliable write, replay-protected memory block (RPMB), temporary and power-on write protection, and field firmware update (FFU) support.
  • Boot and System Integration Boot operation with high-speed boot support, hardware reset signal, command queue and high-priority interrupt (HPI) features for tight host integration.
  • Device Management and Maintenance Background operation, BKOPS control, discard and sanitize, device health report, power-off notification and sleep mode to assist system-level maintenance.
  • Package and Temperature 153-ball TFBGA package (11.5 mm × 13 mm × 1.1 mm) and operating temperature range −40°C to +85°C (AIT).
  • Automotive-Grade Leveling Automotive grade references in the product family include AEC-Q104 and retention compliance (AEC-Q100-005) as noted in the device documentation.

Typical Applications

  • Embedded Storage Native e.MMC storage for system firmware, file systems, and application data in space-constrained designs.
  • Automotive Electronics Storage for automotive infotainment, telematics, and control modules where extended temperature operation and automotive-grade documentation are required.
  • Industrial Controllers Non-volatile flash for data logging, configuration storage, and firmware images in industrial equipment operating from −40°C to +85°C.
  • Boot and Secure Storage Use of the high-speed boot capability and RPMB partition for protected storage of boot loaders and sensitive keys.

Unique Advantages

  • Integrated MMC Controller and NAND Flash: Single-component e.MMC solution reduces BOM and simplifies board-level integration compared to discrete controller-plus-NAND implementations.
  • Flexible Interface Modes: Selectable ×1/×4/×8 I/Os and HS200/HS400 support enable designers to balance throughput and pin usage per system requirements.
  • On-Device Data Management: Built-in ECC, block management, reliable write, and sanitize/discard features reduce host software complexity for flash management.
  • Automotive-Focused Documentation: Family-level automotive references (AEC-Q104 and retention compliance) provide traceable qualifiers for design teams targeting automotive-capable systems.
  • Wide Operating Conditions: Specified operation from −40°C to +85°C and documented data retention metrics support long-term deployment in harsh environments.
  • Compact, Industry-Standard Package: 153-ball TFBGA (11.5 mm × 13 mm) offers a compact form factor for space-constrained PCBs.

Why Choose IC FLASH 512GBIT MMC 153TFBGA?

The MTFC64GAPALBH-AIT positions itself as a compact, standards-compliant e.MMC storage component combining NAND flash and an MMC controller with advanced interface and management features. Its JEDEC 5.1 compliance, multiple I/O modes, and on-device ECC/management make it suitable for embedded designs that require integrated storage with minimal host-side flash management.

This device is appropriate for engineering teams developing embedded, industrial, or automotive-capable systems that require a 512 Gbit non-volatile storage element in a 153-ball TFBGA package, operating across −40°C to +85°C, and leveraging features such as high-speed boot, RPMB, and field firmware update.

For pricing, lead-time and to request a quote for MTFC64GAPALBH-AIT, please submit a request or contact our sales team with your project requirements to receive configuration and availability information.

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