MTFC64GAPALBH-AIT
| Part Description |
IC FLASH 512GBIT MMC 153TFBGA |
|---|---|
| Quantity | 1,544 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-TFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC64GAPALBH-AIT – IC FLASH 512GBIT MMC 153TFBGA
The MTFC64GAPALBH-AIT is a 512 Gbit e.MMC memory device that integrates a MultiMediaCard (MMC) controller with NAND flash. It implements JEDEC/MMC standard version 5.1 functionality and supports advanced interface options for embedded storage.
Targeted at embedded and automotive-capable designs, the device offers multi-I/O modes, high-speed interface options, and on-device management features to simplify system integration while supporting extended temperature operation from −40°C to +85°C.
Key Features
- Memory and Technology 512 Gbit NAND flash organized as 64G × 8, provided in e.MMC format for single-component embedded storage.
- Standards and Interface JEDEC/MMC standard version 5.1-compliant with an advanced 12-signal interface; selectable ×1, ×4 and ×8 I/Os and e.MMC interface clock rates up to 200 MHz (boot frequency up to 52 MHz).
- High-Speed Modes Supports HS200 and HS400 modes for high-throughput data transfer when paired with compatible hosts.
- Power and Voltage Device VCC range 2.7–3.6 V with VCCQ dual-voltage options of 1.70–1.95 V and 2.7–3.6 V.
- System Reliability and Data Protection On-device ECC and block management, reliable write, replay-protected memory block (RPMB), temporary and power-on write protection, and field firmware update (FFU) support.
- Boot and System Integration Boot operation with high-speed boot support, hardware reset signal, command queue and high-priority interrupt (HPI) features for tight host integration.
- Device Management and Maintenance Background operation, BKOPS control, discard and sanitize, device health report, power-off notification and sleep mode to assist system-level maintenance.
- Package and Temperature 153-ball TFBGA package (11.5 mm × 13 mm × 1.1 mm) and operating temperature range −40°C to +85°C (AIT).
- Automotive-Grade Leveling Automotive grade references in the product family include AEC-Q104 and retention compliance (AEC-Q100-005) as noted in the device documentation.
Typical Applications
- Embedded Storage Native e.MMC storage for system firmware, file systems, and application data in space-constrained designs.
- Automotive Electronics Storage for automotive infotainment, telematics, and control modules where extended temperature operation and automotive-grade documentation are required.
- Industrial Controllers Non-volatile flash for data logging, configuration storage, and firmware images in industrial equipment operating from −40°C to +85°C.
- Boot and Secure Storage Use of the high-speed boot capability and RPMB partition for protected storage of boot loaders and sensitive keys.
Unique Advantages
- Integrated MMC Controller and NAND Flash: Single-component e.MMC solution reduces BOM and simplifies board-level integration compared to discrete controller-plus-NAND implementations.
- Flexible Interface Modes: Selectable ×1/×4/×8 I/Os and HS200/HS400 support enable designers to balance throughput and pin usage per system requirements.
- On-Device Data Management: Built-in ECC, block management, reliable write, and sanitize/discard features reduce host software complexity for flash management.
- Automotive-Focused Documentation: Family-level automotive references (AEC-Q104 and retention compliance) provide traceable qualifiers for design teams targeting automotive-capable systems.
- Wide Operating Conditions: Specified operation from −40°C to +85°C and documented data retention metrics support long-term deployment in harsh environments.
- Compact, Industry-Standard Package: 153-ball TFBGA (11.5 mm × 13 mm) offers a compact form factor for space-constrained PCBs.
Why Choose IC FLASH 512GBIT MMC 153TFBGA?
The MTFC64GAPALBH-AIT positions itself as a compact, standards-compliant e.MMC storage component combining NAND flash and an MMC controller with advanced interface and management features. Its JEDEC 5.1 compliance, multiple I/O modes, and on-device ECC/management make it suitable for embedded designs that require integrated storage with minimal host-side flash management.
This device is appropriate for engineering teams developing embedded, industrial, or automotive-capable systems that require a 512 Gbit non-volatile storage element in a 153-ball TFBGA package, operating across −40°C to +85°C, and leveraging features such as high-speed boot, RPMB, and field firmware update.
For pricing, lead-time and to request a quote for MTFC64GAPALBH-AIT, please submit a request or contact our sales team with your project requirements to receive configuration and availability information.