MTFC64GANALAM-WT

IC FLASH 512GBIT MMC 153LFBGA
Part Description

IC FLASH 512GBIT MMC 153LFBGA

Quantity 1,584 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageN/AMemory FormatFLASHTechnologyFLASH - NAND
Memory Size512 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltageN/AMemory TypeNon-Volatile
Operating Temperature-25°C ~ 85°C (TA)Write Cycle Time Word PageN/APackagingN/A
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization64G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC64GANALAM-WT – IC FLASH 512GBIT MMC 153LFBGA

The MTFC64GANALAM-WT is a Micron e.MMC memory device providing 512 Gbit of non-volatile NAND flash storage in a 153-ball FBGA package. The device integrates an MMC controller with NAND flash memory and implements JEDEC/MMC Standard 5.1 features for embedded storage applications.

Architected for systems that require MMC interface storage with selectable I/O widths and high-speed operation, this device addresses designs needing boot operation, partitioning, and secure/RPMB functionality while operating across a wide temperature range.

Key Features

  • Core Memory 512 Gbit NAND flash organized as 64G × 8, offering non-volatile embedded storage.
  • MMC Interface and Standards JEDEC/MMC standard version 5.1-compliant with an advanced 12-signal interface and support for x1, x4, and x8 I/Os selectable by the host.
  • High-Speed Modes Supports e.MMC boot frequency up to 52 MHz and host clock frequency up to 200 MHz, including HS200 and HS400 modes for higher throughput.
  • Power Rails VCCM: 2.70–3.60 V and VCCQM: 1.70–1.95 V as specified for device operation.
  • Boot and Security Boot operation (high-speed boot), Replay-Protected Memory Block (RPMB), secure erase, secure trim, and temporary/permanent/power-on write protection options.
  • Partitioning and Management Multiple partitions with enhanced attributes, extended partitioning, cache, reliable write, discard and sanitize, and background operations.
  • Command and Data Features Command classes 0, 2, 4, 5, 6, and 7; packed commands; command queueing; context ID and data tag support; high-priority interrupt (HPI).
  • Reliability ECC and block management implemented for error handling and flash defect management.
  • Package and Temperature 153-ball VFBGA package (11.5 mm × 13.0 mm × 1.0 mm) with operating temperature range –25°C to +85°C and storage range –40°C to +85°C. The package is RoHS compliant ("green package").

Typical Applications

  • Embedded storage systems — Provides JEDEC/MMC 5.1-compliant flash memory for embedded designs that require on-board MMC interface storage and boot capability.
  • Designs requiring secure storage — Use RPMB, secure erase/trim and write-protection features to isolate secure partitions and protect critical data.
  • High-throughput storage functions — HS200/HS400 support and selectable I/O widths enable higher data-rate operation for systems that need accelerated block reads/writes.
  • Partitioned storage architectures — Multiple partitions with enhanced attributes and extended partitioning support segmented storage layouts and boot/data separation.

Unique Advantages

  • Integrated MMC controller and NAND flash: Combines controller and Flash in a single e.MMC device to simplify host integration and firmware management.
  • Flexible interface scaling: Selectable x1/x4/x8 I/Os plus HS200/HS400 modes allow designers to balance throughput and pin usage per system requirements.
  • Boot and secure features built-in: High-speed boot, RPMB, and secure erase/trim remove the need for separate secure storage components in many designs.
  • Robust data management: ECC, block management, reliable write, and background operations support sustained data integrity and flash maintenance.
  • Wide operating conditions: Specified operating and storage temperature ranges and RoHS-compliant package provide compatibility across varied environmental conditions.

Why Choose MTFC64GANALAM-WT?

The MTFC64GANALAM-WT positions itself as an integrated e.MMC storage solution that combines Micron NAND flash with an MMC controller and a comprehensive feature set from JEDEC MMC 5.1. Its support for selectable I/O widths, high-speed modes, secure/RPMB partitions, and onboard management features makes it suitable for designs that require compact, managed non-volatile storage with boot and secure storage capabilities.

This device is appropriate for engineers and procurement teams specifying embedded MMC storage where integration, partitioning flexibility, and the documented power and temperature ranges are key selection criteria. Its feature set supports scalable performance and storage management without adding external controller complexity.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for MTFC64GANALAM-WT.

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