MTFC64GAKAEEY-3M WT TR

The MTFC64GAKAEEY-3M WT TR is a Micron e•MMC™ device that integrates a MultiMediaCard (MMC) controller with NAND flash memory in a 153-ball LFBGA package. It provides 512 Gbit of non-volatile NAND flash organized as 64G × 8 and implements the MMC interface and related e.MMC features.

This device targets designs that require on-board MMC connectivity, JEDEC/MMC v5.0 functionality and embedded non-volatile storage with hardware-managed reliability and security features.

Key Features

• Core Architecture  Integrated MultiMediaCard (MMC) controller with NAND Flash—combines controller and flash in a single e.MMC product.
• Memory Capacity & Organization  512 Gbit total capacity organized as 64G × 8, providing high-density non-volatile storage.
• Memory Technology  FLASH - NAND technology with MLC partition performance characterized in the datasheet.
• MMC Interface & Bus Modes  JEDEC/MMC standard version 5.0-compliant with an advanced 12-signal interface; supports x1, x4, and x8 I/Os selectable by the host, SDR/DDR modes up to 52 MHz, and HS200/HS400 operation modes.
• Performance (64 GByte partition metrics)  HS400 sequential read up to 280 MB/s and sequential write up to 50 MB/s; random read up to 4,700 IOPS and random write (cache on) up to 5,800 IOPS as reported for the 64GB device.
• Power Domains  VCC: 2.7–3.6 V; VCCQ (dual-voltage): 1.65–1.95 V and 2.7–3.6 V, enabling flexible host interface voltage options.
• Reliability & Security  Built-in ECC and block management, reliable write, temporary and permanent write protection, replay-protected memory block (RPMB), secure erase/trim and discard/sanitize functions.
• System & Maintainability  Field firmware update (FFU), device health report, background operation, context ID and high-priority interrupt (HPI) support for managed operation and diagnostics.
• Package & Temperature  153-LFBGA package (11.5 × 13 mm) with an operating temperature range of –25 °C to +85 °C and storage temperature range of –40 °C to +85 °C.

Unique Advantages

• Integrated MMC controller and NAND: Reduces system-level integration points by delivering controller and flash in a single e.MMC device.
• JEDEC v5.0 compliance: Ensures a defined MMC feature set including advanced bus modes (HS200/HS400) and multi-width I/O for interface flexibility.
• Performance scaling: Documented HS400 and HS200 read/write and IOPS metrics for the 64GB partition provide clear performance expectations for system designers.
• Built-in data integrity features: ECC, block management and reliable-write mechanisms support sustained data reliability without external management.
• Serviceability features: Field firmware update, device health reporting and background operation support maintainability and in-field updates.

Why Choose IC FLASH 512GBIT MMC 153LFBGA?

The MTFC64GAKAEEY-3M WT TR positions itself as a high-density e.MMC solution combining a Micron MMC controller and 512 Gbit NAND flash in a compact 153-LFBGA package. With JEDEC/MMC v5.0 compliance, multi-width I/O, HS200/HS400 support and documented performance metrics for the 64GB partition, it fits designs that require standardized MMC interfaces, on-board management of flash, and built-in security and reliability features.

Its voltage flexibility, on-device ECC and block management, firmware update capability and device health reporting provide design-level robustness and maintainability while aligning with other capacities listed in the Micron e.MMC family.

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