MTFC64GAJAEDQ-AAT TR
| Part Description |
IC FLASH 512GBIT MMC 100LBGA |
|---|---|
| Quantity | 929 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 100-LBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 100-LBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC64GAJAEDQ-AAT TR – IC FLASH 512GBIT MMC 100LBGA
The MTFC64GAJAEDQ-AAT TR is a 512 Gbit non-volatile NAND flash memory device that integrates a MultiMediaCard (MMC) controller and NAND Flash in an e.MMC form factor. The memory is organized as 64G × 8 and implements e.MMC features and management functions described in the device datasheet.
Built to the JEDEC/MMC standard version 5.0, the device supports a full MMC interface with selectable ×1, ×4 and ×8 I/Os, multiple performance modes, and on-device features for boot, secure partitions, firmware updates and device health reporting.
Key Features
- Memory Core 512 Gbit NAND Flash, organized as 64G × 8, providing high-density non-volatile storage in a single device.
- MMC Interface and Modes JEDEC/MMC standard version 5.0-compliant with an advanced 12-signal interface. Host-selectable ×1, ×4 and ×8 I/Os and support for SDR/DDR modes up to 52 MHz, plus HS200/HS400 modes.
- Voltage VCC: 2.7–3.6V; VCCQ (dual voltage): 1.65–1.95V or 2.7–3.6V as specified in the device documentation.
- Operational Features Supports boot operation (high-speed boot), sleep mode, background operation, and power-off notification to manage device behavior during system events.
- Data Integrity & Management On-device ECC and block management are implemented; features include reliable write, discard and sanitize, and a device health report for lifecycle monitoring.
- Security & Partitioning Replay-protected memory block (RPMB), multiple partitions with enhanced attributes, temporary and permanent write protection, lock and write-protection command classes are supported.
- Package and Temperature Range Supplied in a 100-ball LBGA (14 × 18 mm) package with an operating temperature range of −40°C to +105°C (TA) for extended-temperature applications.
- Field Maintenance Field firmware update (FFU) capability and device health reporting to support in-field updates and diagnostics.
Unique Advantages
- High-capacity onboard storage: 512 Gbit density in a single e.MMC device reduces the need for additional external storage components.
- Standards-based compatibility: JEDEC/MMC 5.0 compliance and a standard MMC interface simplify integration with hosts that support the MMC specification.
- Flexible performance modes: Host-selectable ×1/×4/×8 I/Os and SDR/DDR plus HS200/HS400 modes allow tuning for different throughput and design requirements.
- Built-in reliability and lifecycle tools: ECC, block management, reliable write and device health reporting help manage data integrity and device lifetime.
- Security and partition control: RPMB, multiple partitions and write-protection features enable secure storage and controlled access within the device.
- Compact, extended-temperature package: 100-ball LBGA (14 × 18 mm) with −40°C to +105°C operating range supports space-constrained designs targeting extended-temperature environments.
Why Choose IC FLASH 512GBIT MMC 100LBGA?
The IC FLASH 512GBIT MMC 100LBGA (MTFC64GAJAEDQ-AAT TR) brings a high-density NAND flash array combined with an integrated MMC controller and a comprehensive set of on-device features—boot operation, RPMB, ECC/block management, firmware update and device health reporting—aligned to the JEDEC/MMC 5.0 specification. This combination provides a compact, standards-based storage solution for designs that require integrated non-volatile storage with advanced management and security capabilities.
Its wide operating temperature range and 100-ball LBGA package make the device suitable for systems where board space and extended-temperature operation are considerations, while on-device maintenance and protection features support long-term product lifecycle management.
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