MTFC64GAJAEDN-AIT TR
| Part Description |
IC FLASH 512GBIT MMC 169LFBGA |
|---|---|
| Quantity | 1,487 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 169-LFBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 169-LFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC64GAJAEDN-AIT TR – IC FLASH 512GBIT MMC 169LFBGA
The MTFC64GAJAEDN-AIT TR is a 512 Gbit (64 GByte) e.MMC memory device integrating a MultiMediaCard controller with NAND Flash memory in a 169-ball LFBGA (14 × 18 mm) package. It implements the JEDEC/MMC standard version 5.0 architecture and provides onboard non-volatile storage for embedded systems.
Designed for applications that require embedded storage and boot capability, this device combines high-density NAND Flash organization with a multi-signal MMC interface and on-die management features to simplify system integration and storage management.
Key Features
- Memory Core 512 Gbit NAND Flash organized as 64G × 8 in an e.MMC memory format.
- Standards Compliance JEDEC/MMC standard version 5.0-compliant implementation (JESD84-B50).
- Integrated Controller + NAND MultiMediaCard controller integrated with NAND Flash to provide managed, non-volatile storage.
- Interface Flexibility Advanced 12-signal MMC interface supporting ×1, ×4, and ×8 I/Os selectable by the host; SDR/DDR modes up to 52 MHz; HS200/HS400 modes.
- Power Domains VCC 2.7–3.6 V and VCCQ dual-voltage support 1.70–1.95 V or 2.7–3.6 V as specified in the device documentation.
- System & Data Management Features including ECC and block management, reliable write, discard and sanitize, background operation, and device health report for maintained data integrity.
- Security & Protection Replay-protected memory block (RPMB), temporary/permanent and power-on write protection, lock card and write-protect command classes.
- Boot and Maintenance High-speed boot operation, field firmware update (FFU), hardware reset signal, and power-off notification support system-level maintenance and firmware management.
- Package & Temperature 169-LFBGA (14 × 18 mm × 1.4 mm) package; operating temperature range –40°C to +85°C (TA).
Typical Applications
- Embedded storage and boot Use as onboard non-volatile memory for system boot and firmware storage leveraging the device’s high-speed boot capability.
- Firmware and field updates Field firmware update (FFU) and background operation features enable in-system firmware maintenance and updates.
- Secure data areas Replay-protected memory block (RPMB) and multiple write-protection options support secure storage for credentials and protected data.
Unique Advantages
- Standards-based implementation: JEDEC/MMC 5.0 compliance ensures consistent behavior with host controllers that follow the same standard.
- Integrated managed storage: The combination of controller and NAND Flash reduces host-side management overhead and simplifies BOM.
- Flexible interface modes: Selectable ×1/×4/×8 I/Os and SDR/DDR/HS200/HS400 support enable adaptation to a range of host performance requirements.
- Data integrity features: On-die ECC, block management, reliable write, and device health reporting help maintain data reliability over the device lifetime.
- Secure and protected partitions: RPMB, multiple partition attributes, and write-protection mechanisms enable secure storage partitions and controlled access.
- Wide operating range and compact package: –40°C to +85°C rating in a compact 169-LFBGA package supports space-constrained embedded designs.
Why Choose MTFC64GAJAEDN-AIT TR?
The MTFC64GAJAEDN-AIT TR delivers a managed, high-density e.MMC storage solution that combines Micron NAND Flash with an integrated MMC controller and a feature set focused on data integrity, security, and in-system maintainability. Its JEDEC/MMC 5.0 compliance and flexible interface modes make it suitable for embedded designs that require a compact, integrated non-volatile memory subsystem.
As part of a Micron e.MMC family that spans multiple densities, this device provides a scalable option for designs needing onboard storage with boot capability, secure partitions, and firmware-update support, backed by Micron's production datasheet specifications.
To request a quote or submit a procurement request for MTFC64GAJAEDN-AIT TR, please reach out to your purchasing channel or submit a request for pricing and availability.