MTFC64GAJAECE-AIT
| Part Description |
IC FLASH 512GBIT MMC 169LFBGA |
|---|---|
| Quantity | 29 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 169-LFBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 169-LFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC64GAJAECE-AIT – IC FLASH 512GBIT MMC 169LFBGA
The MTFC64GAJAECE-AIT is a Micron e.MMC non-volatile NAND Flash memory device providing 512 Gbit of storage in a 169‑LFBGA package. It integrates a MultiMediaCard (MMC) controller with NAND Flash to deliver JEDEC/MMC 5.0‑compliant embedded storage with advanced interface and management features.
Designed for embedded systems that require MMC-based storage, boot operation and secure data handling, this device targets designs needing high-density NAND Flash in a compact 14 × 18 mm LFBGA footprint and extended temperature operation from –40°C to +85°C.
Key Features
- Memory Type & Capacity Non‑volatile FLASH (NAND) with a memory size of 512 Gbit and memory organization of 64G × 8.
- Standard Compliance & Interface JEDEC/MMC Standard No. JESD84‑B50 (MMC 5.0) compliant; MMC memory interface with an advanced 12‑signal interface and selectable ×1, ×4, and ×8 I/Os.
- Performance Modes Supports SDR and DDR modes up to a 52 MHz clock, plus HS200 and HS400 modes for high‑speed data transfer and high‑speed boot operation.
- Security & Protected Storage Includes replay‑protected memory block (RPMB), temporary and permanent write protection, lock card features and high‑priority interrupt (HPI).
- Data Integrity & Management On‑device ECC and block management, reliable write, discard and sanitize, device health report, and power‑off notification to support robust data handling.
- System & Maintenance Features Field firmware update (FFU), background operation, sleep mode and hardware reset signal to support flexible system maintenance and power management.
- Voltage VCC: 2.7–3.6 V; VCCQ (dual voltage): 1.70–1.95 V or 2.7–3.6 V.
- Package & Temperature 169‑LFBGA (14 × 18 mm, 169‑ball) package; operating temperature range –40°C to +85°C (TA).
Typical Applications
- Embedded storage Systems that require on‑board MMC storage with boot capability and integrated NAND controller for compact integration.
- Secure data storage Devices that need replay‑protected memory (RPMB), write protection and device health reporting for secure credential or protected data storage.
- Industrial and temperature‑sensitive equipment Applications operating across –40°C to +85°C that require high‑density, reliable non‑volatile memory in a small LFBGA package.
Unique Advantages
- JEDEC/MMC 5.0 compliance: Ensures compatibility with hosts and ecosystems implementing the JEDEC MMC v5.0 specification.
- Flexible high‑speed interface: Selectable ×1/×4/×8 I/Os with SDR/DDR and HS200/HS400 support enables matching interface configuration to system requirements.
- Integrated controller and NAND: Combines MMC controller and NAND Flash in a single package to simplify board integration and reduce host controller overhead.
- Comprehensive data management: On‑device ECC, block management, reliable write and device health reporting reduce system firmware complexity for data integrity and maintenance.
- Built‑in security features: RPMB, temporary and permanent write protection and lock features support secure storage use cases.
- Compact, board‑friendly package: 169‑LFBGA (14 × 18 mm) delivers high density in a compact form factor for space‑constrained designs.
Why Choose MTFC64GAJAECE-AIT?
The MTFC64GAJAECE-AIT positions Micron’s e.MMC architecture as a compact, JEDEC‑compliant embedded storage solution that integrates NAND Flash and an MMC controller with a broad set of system, security and data‑management features. Its voltage options, selectable I/O widths and HS200/HS400 support provide flexibility to match a range of host implementations.
This device is suited for designers needing high‑density non‑volatile storage with built‑in reliability and secure storage features, and for projects requiring operation across –40°C to +85°C in a 169‑LFBGA footprint.
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