MTFC64GAJAECE-AIT TR
| Part Description |
IC FLASH 512GBIT MMC 169LFBGA |
|---|---|
| Quantity | 137 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 169-LFBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 169-LFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC64GAJAECE-AIT TR – IC FLASH 512GBIT MMC 169LFBGA
The MTFC64GAJAECE-AIT TR is a 512 Gbit non-volatile NAND Flash memory device in Micron’s e•MMC™ family. It integrates a MultiMediaCard (MMC) controller and NAND Flash in a 169-LFBGA (14 × 18 mm) package for compact embedded storage.
Designed to the JEDEC/MMC standard version 5.0, the device provides an MMC interface with multi-I/O options and features aimed at bootable and secure embedded storage, operating across a −40°C to 85°C ambient temperature range.
Key Features
- Memory 512 Gbit NAND Flash organized as 64G × 8 for non-volatile data storage.
- Interface JEDEC/MMC 5.0-compliant MMC interface with advanced 12-signal connectivity and selectable ×1, ×4, and ×8 I/O widths.
- Performance Modes Supports SDR/DDR modes up to 52 MHz and high-speed HS200/HS400 modes for accelerated data transfer.
- Power and IO Voltages VCC: 2.7–3.6V; VCCQ (dual voltage): 1.70–1.95V or 2.7–3.6V, enabling flexible host voltage configurations.
- System Reliability Built-in ECC and block management, reliable write, discard and sanitize functions, and device health reporting help maintain data integrity and lifecycle visibility.
- Security and Partitioning Replay-protected memory block (RPMB), multiple partitions with enhanced attributes, temporary and permanent write protection, and lock features for secure storage needs.
- Boot and Maintenance Boot operation (high-speed boot), field firmware update (FFU), background operation and power-off notification features support robust system boot and firmware management.
- Package and Temperature 169-ball LFBGA package (14 × 18 mm) specified for operation from −40°C to +85°C (TA).
Typical Applications
- Boot storage for embedded hosts High-speed boot operation and MMC interface make the device suitable for storing boot firmware and images used by host controllers.
- Secure data storage RPMB and write-protection features provide authenticated and protected storage regions for secure keys and sensitive data.
- Field-updatable systems Field firmware update (FFU) support and device health reporting facilitate in-service firmware updates and lifecycle monitoring.
Unique Advantages
- Standards-based integration: JEDEC/MMC 5.0 compliance ensures predictable behavior with MMC-host controllers that support the standard.
- Flexible performance modes: SDR/DDR up to 52 MHz and HS200/HS400 support let designers optimize throughput for different system requirements.
- Secure partitioning and protection: RPMB, multiple partitions, and write-protection features enable hardware-supported security and data separation.
- Integrated reliability features: On-device ECC and block management reduce host overhead for wear leveling and error correction.
- Wide operating temperature: Specified operation from −40°C to +85°C supports a range of temperature environments for embedded systems.
- Compact BGA package: 169-LFBGA (14 × 18 mm) packaging provides a high-density, space-efficient footprint for compact designs.
Why Choose IC FLASH 512GBIT MMC 169LFBGA?
The MTFC64GAJAECE-AIT TR combines Micron’s NAND Flash with an integrated MMC controller to deliver a compact, standards-compliant e.MMC storage solution. Its feature set — including JEDEC/MMC 5.0 support, multiple I/O widths, high-speed modes, RPMB security, and on-device reliability functions — positions it for designs that require embedded boot capability, secure partitions, and in-field firmware management.
This device is suited to designers seeking a dense, integrated flash module in a 169-LFBGA package with specified operation from −40°C to +85°C and flexible voltage support (VCC/VCCQ). It provides long-term value through integrated maintenance and security features and Micron’s controller-plus-NAND architecture.
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