MTFC64GAJAECE-AAT TR
| Part Description |
IC FLASH 512GBIT MMC 169LFBGA |
|---|---|
| Quantity | 391 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 169-LFBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 169-LFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 1 (Unlimited) | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC64GAJAECE-AAT TR – IC FLASH 512GBIT MMC 169LFBGA
The MTFC64GAJAECE-AAT TR is a Micron e.MMC solution that integrates a MultiMediaCard (MMC) controller with NAND flash memory in a 169-ball LFBGA package. It provides 512 Gbit of non-volatile NAND flash organized as 64G × 8 and supports the MMC memory interface for embedded storage applications.
Key architectural elements include JEDEC/MMC Standard 5.0 compliance, an advanced 12-signal interface with selectable ×1, ×4, and ×8 I/Os, and on-device management features for boot, security, and reliability. The device operates across a wide temperature range of −40°C to +105°C.
Key Features
- Core Architecture Integrated MultiMediaCard (MMC) controller and NAND flash in a single e.MMC device.
- Memory Capacity & Organization 512 Gbit total capacity arranged as 64G × 8, delivered in NAND flash format.
- JEDEC/MMC 5.0 Compliance Conforms to JEDEC/MMC standard version 5.0 (JESD84-B50) for standardized host compatibility.
- Interface & Performance Modes Advanced 12-signal interface with selectable ×1, ×4, and ×8 I/O widths; supports SDR/DDR up to 52 MHz and HS200/HS400 modes.
- Power Supply VCC: 2.7–3.6 V; VCCQ (dual-voltage): 1.70–1.95 V or 2.7–3.6 V as supported by the device.
- Reliability & Data Management On-device ECC and block management, reliable write, discard and sanitize functions, and background operation to support data integrity.
- Security & Partitioning Replay-protected memory block (RPMB), temporary and permanent write protection, multiple partitions with enhanced attributes, and lock/protection command classes.
- System & Maintenance Features Boot operation (high-speed boot), hardware reset signal, field firmware update (FFU), device health report, power-off notification, and sleep mode with sleep notification.
- Package & Temperature Supplied in a 169-LFBGA (14 × 18 mm) package and specified for an operating temperature range of −40°C to +105°C (TA).
Typical Applications
- Bootable Embedded Storage Use for systems that require on-board boot capability, leveraging the device's high-speed boot support and integrated MMC controller.
- Secure Data Storage Suitable for designs needing authenticated storage regions and write protection via RPMB, temporary and permanent write-protect features.
- High-Reliability Systems Applicable where data integrity is critical, taking advantage of on-device ECC, block management, reliable write, and device health reporting.
- Wide-Temperature Environments Designed for deployments requiring operation from −40°C to +105°C, enabled by the AAT temperature grade.
Unique Advantages
- Integrated MMC Controller and NAND Reduces external controller requirements by combining the controller and NAND flash into a single e.MMC device.
- JEDEC-Compliant Interface JEDEC/MMC 5.0 compliance and an advanced 12-signal interface simplify host integration and maintain standard interoperability.
- Flexible I/O and Performance Modes Selectable ×1/×4/×8 I/Os and support for SDR/DDR up to 52 MHz plus HS200/HS400 modes enable adaptable bandwidth profiles for different system needs.
- High Capacity in a Compact Package 512 Gbit density in a 169-LFBGA (14 × 18 mm) package offers high-density embedded storage while preserving PCB area.
- Built-In Security and Data Integrity RPMB, write-protection options, ECC, block management, and reliable write features help protect stored data and simplify system-level security design.
- Field Maintainability Field firmware update (FFU) and device health reporting support in-field servicing and monitoring of storage health.
Why Choose MTFC64GAJAECE-AAT TR?
The MTFC64GAJAECE-AAT TR is positioned as a high-density e.MMC storage component that combines a compliant MMC controller with NAND flash to deliver bootable, partitionable, and secure embedded storage. Its JEDEC/MMC 5.0 feature set, flexible I/O options, and integrated data-management features address design needs where standardized interface, data integrity, and secure storage regions are required.
This device is suitable for designs that require large-capacity non-volatile memory in a compact 169-LFBGA package and operation across −40°C to +105°C. Documentation and feature sets included in the Micron e.MMC product family provide a consistent reference for system integration and long-term deployment considerations.
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