MTFC64GAJAECE-AAT TR

IC FLASH 512GBIT MMC 169LFBGA
Part Description

IC FLASH 512GBIT MMC 169LFBGA

Quantity 391 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package169-LFBGA (14x18)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size512 GbitAccess TimeN/AGradeAutomotive
Clock FrequencyN/AVoltageN/AMemory TypeNon-Volatile
Operating Temperature-40°C ~ 105°C (TA)Write Cycle Time Word PageN/APackaging169-LFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization64G x 8
Moisture Sensitivity Level1 (Unlimited)RoHS ComplianceUnknownREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC64GAJAECE-AAT TR – IC FLASH 512GBIT MMC 169LFBGA

The MTFC64GAJAECE-AAT TR is a Micron e.MMC solution that integrates a MultiMediaCard (MMC) controller with NAND flash memory in a 169-ball LFBGA package. It provides 512 Gbit of non-volatile NAND flash organized as 64G × 8 and supports the MMC memory interface for embedded storage applications.

Key architectural elements include JEDEC/MMC Standard 5.0 compliance, an advanced 12-signal interface with selectable ×1, ×4, and ×8 I/Os, and on-device management features for boot, security, and reliability. The device operates across a wide temperature range of −40°C to +105°C.

Key Features

  • Core Architecture Integrated MultiMediaCard (MMC) controller and NAND flash in a single e.MMC device.
  • Memory Capacity & Organization 512 Gbit total capacity arranged as 64G × 8, delivered in NAND flash format.
  • JEDEC/MMC 5.0 Compliance Conforms to JEDEC/MMC standard version 5.0 (JESD84-B50) for standardized host compatibility.
  • Interface & Performance Modes Advanced 12-signal interface with selectable ×1, ×4, and ×8 I/O widths; supports SDR/DDR up to 52 MHz and HS200/HS400 modes.
  • Power Supply VCC: 2.7–3.6 V; VCCQ (dual-voltage): 1.70–1.95 V or 2.7–3.6 V as supported by the device.
  • Reliability & Data Management On-device ECC and block management, reliable write, discard and sanitize functions, and background operation to support data integrity.
  • Security & Partitioning Replay-protected memory block (RPMB), temporary and permanent write protection, multiple partitions with enhanced attributes, and lock/protection command classes.
  • System & Maintenance Features Boot operation (high-speed boot), hardware reset signal, field firmware update (FFU), device health report, power-off notification, and sleep mode with sleep notification.
  • Package & Temperature Supplied in a 169-LFBGA (14 × 18 mm) package and specified for an operating temperature range of −40°C to +105°C (TA).

Typical Applications

  • Bootable Embedded Storage Use for systems that require on-board boot capability, leveraging the device's high-speed boot support and integrated MMC controller.
  • Secure Data Storage Suitable for designs needing authenticated storage regions and write protection via RPMB, temporary and permanent write-protect features.
  • High-Reliability Systems Applicable where data integrity is critical, taking advantage of on-device ECC, block management, reliable write, and device health reporting.
  • Wide-Temperature Environments Designed for deployments requiring operation from −40°C to +105°C, enabled by the AAT temperature grade.

Unique Advantages

  • Integrated MMC Controller and NAND Reduces external controller requirements by combining the controller and NAND flash into a single e.MMC device.
  • JEDEC-Compliant Interface JEDEC/MMC 5.0 compliance and an advanced 12-signal interface simplify host integration and maintain standard interoperability.
  • Flexible I/O and Performance Modes Selectable ×1/×4/×8 I/Os and support for SDR/DDR up to 52 MHz plus HS200/HS400 modes enable adaptable bandwidth profiles for different system needs.
  • High Capacity in a Compact Package 512 Gbit density in a 169-LFBGA (14 × 18 mm) package offers high-density embedded storage while preserving PCB area.
  • Built-In Security and Data Integrity RPMB, write-protection options, ECC, block management, and reliable write features help protect stored data and simplify system-level security design.
  • Field Maintainability Field firmware update (FFU) and device health reporting support in-field servicing and monitoring of storage health.

Why Choose MTFC64GAJAECE-AAT TR?

The MTFC64GAJAECE-AAT TR is positioned as a high-density e.MMC storage component that combines a compliant MMC controller with NAND flash to deliver bootable, partitionable, and secure embedded storage. Its JEDEC/MMC 5.0 feature set, flexible I/O options, and integrated data-management features address design needs where standardized interface, data integrity, and secure storage regions are required.

This device is suitable for designs that require large-capacity non-volatile memory in a compact 169-LFBGA package and operation across −40°C to +105°C. Documentation and feature sets included in the Micron e.MMC product family provide a consistent reference for system integration and long-term deployment considerations.

Request a quote or submit an inquiry to receive pricing and availability information for the MTFC64GAJAECE-AAT TR 512 Gbit e.MMC device.

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