MTFC4GMXEA-WT TR

IC FLASH 32GBIT MMC 153WFBGA
Part Description

IC FLASH 32GBIT MMC 153WFBGA

Quantity 1,447 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-WFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size32 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-25°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-WFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization4G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC4GMXEA-WT TR – 32 Gbit e•MMC™ NAND Flash, 153-WFBGA

The MTFC4GMXEA-WT TR is a non-volatile FLASH NAND memory device in Micron Technology Inc.'s e•MMC™ series. It provides 32 Gbit of organized storage (4G × 8) with an MMC memory interface for embedded storage implementations.

Designed with a 153-WFBGA (11.5×13 mm) package and specified electrical and environmental limits, this device targets systems requiring compact NAND flash storage with defined supply and temperature ranges.

Key Features

  • Memory Type & Technology  Non-volatile FLASH memory using NAND technology, providing persistent storage.
  • Capacity & Organization  32 Gbit organized as 4G × 8, delivering block-level FLASH storage density.
  • Interface  MMC memory interface, intended for designs that integrate MMC-based storage.
  • Power  Supply voltage range of 2.7 V to 3.6 V for compatibility with common embedded power domains.
  • Package  153-WFBGA package (11.5×13 mm) for compact PCB footprint and surface-mount assembly.
  • Operating Temperature  Specified ambient range of −25°C to 85°C (TA) for use in temperature-varied environments.
  • Product Family  Part of the e•MMC™ series from Micron Technology Inc., identified as an MMC-format FLASH device.

Typical Applications

  • Embedded Storage  MMC-interface non-volatile storage for embedded systems requiring on-board FLASH capacity.
  • Space-Constrained Designs  Compact 153-WFBGA (11.5×13 mm) package suited to designs where PCB area is limited.
  • Temperature-Variable Equipment  Systems operating within −25°C to 85°C that need defined environmental performance for FLASH storage.

Unique Advantages

  • High Storage Density: 32 Gbit capacity organized as 4G × 8 provides substantial on-board FLASH storage in a single device.
  • MMC Interface: Standard MMC memory interface simplifies integration into MMC-compatible designs.
  • Wide Supply Range: Operates from 2.7 V to 3.6 V, matching common embedded voltage rails.
  • Compact Package: 153-WFBGA (11.5×13 mm) package minimizes PCB area while supporting surface-mount assembly.
  • Defined Thermal Range: Specified for −25°C to 85°C ambient operation, enabling use in a range of environments.
  • Micron e•MMC™ Series: Part of Micron Technology Inc.'s e•MMC™ family, offering a recognized FLASH MMC product format.

Why Choose MTFC4GMXEA-WT TR?

The MTFC4GMXEA-WT TR combines 32 Gbit NAND FLASH capacity with an MMC interface and a compact 153-WFBGA package, presenting a clear option for designs that require embedded non-volatile storage within specified electrical and environmental limits. Its supply voltage range and operating temperature specification make it suitable for a variety of MMC-based storage applications.

Engineers and procurement teams looking for a Micron e•MMC™-series FLASH device can rely on the explicit capacity, package, interface, and operating parameters provided for predictable integration into their designs.

Request a quote or contact sales to discuss availability, pricing, and technical details for the MTFC4GMXEA-WT TR.

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