MTFC64GAJAECE-AAT
| Part Description |
IC FLASH 512GBIT MMC 169LFBGA |
|---|---|
| Quantity | 1,601 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 169-LFBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 169-LFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 1 (Unlimited) | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC64GAJAECE-AAT – IC FLASH 512GBIT MMC 169LFBGA
The MTFC64GAJAECE-AAT is a 512 Gbit NAND flash e.MMC memory device in a 169-LFBGA (14×18) package. It integrates a MultiMediaCard (MMC) controller and NAND flash to provide high-density, embedded non-volatile storage with an MMC interface.
Designed for embedded systems requiring standard-compliant e.MMC storage, the device offers advanced interface modes, security and maintenance features, and an extended operating temperature range of −40°C to +105°C.
Key Features
- e.MMC JEDEC Compliance — JEDEC/MMC standard version 5.0-compliant (JESD84-B50), providing a standardized MMC interface implementation.
- Memory Technology & Capacity — NAND Flash non-volatile memory, organized as 64G × 8 for a total of 512 Gbit.
- Interface and Speed Modes — Advanced 12-signal MMC interface supporting ×1, ×4, and ×8 I/Os (host-selectable), SDR/DDR modes up to 52 MHz, and HS200/HS400 modes.
- Power Domains — VCC operating range 2.7–3.6V; VCCQ dual-voltage options 1.70–1.95V or 2.7–3.6V as specified in device options.
- Security & Partitioning — Replay-Protected Memory Block (RPMB), multiple partitions with enhanced attributes, temporary and permanent write protection, and lock features.
- System Reliability Features — ECC and block management implemented, reliable write, power-off notification, background operation, device health report, and field firmware update (FFU).
- Boot & Maintenance — High-speed boot operation, hardware reset signal, sleep mode, sleep notification, and discard/sanitize capabilities.
- Package & Temperature — 169-ball LFBGA package (14 mm × 18 mm, 1.4 mm) with an operating temperature range of −40°C to +105°C (TA) for extended-environment deployments.
Typical Applications
- System Boot and Firmware Storage — High-speed boot operation and field firmware update support make the device suitable for storing boot images and firmware.
- Secure Embedded Storage — RPMB, multiple partitioning and write protection features enable secure storage of credentials, logs, or protected data.
- Industrial and Extended-Temperature Systems — The −40°C to +105°C operating range supports embedded designs operating in extended or harsh temperature environments.
Unique Advantages
- Integrated MMC Controller and NAND Flash: Combines controller and NAND in a single e.MMC device to simplify board-level integration and reduce design complexity.
- Standards-Based Interface: JEDEC MMC 5.0 compliance ensures a standardized host interface and compatibility with MMC-supporting hosts.
- Flexible Performance Modes: Support for ×1/×4/×8 I/Os, SDR/DDR up to 52 MHz, and HS200/HS400 modes enables adaptable performance scaling by host configuration.
- Data Integrity and Maintenance: Built-in ECC, block management, reliable write, and device health reporting help maintain data integrity and support long-term maintenance.
- Field Serviceability: Field firmware update (FFU), power-off notification, and background operation features facilitate in-field updates and maintenance without full system downtime.
- Extended-Temperature Robustness: Specified operation from −40°C to +105°C supports deployments in demanding temperature environments.
Why Choose IC FLASH 512GBIT MMC 169LFBGA?
The MTFC64GAJAECE-AAT positions as a high-density e.MMC solution that combines NAND flash and an MMC controller in a single 169-LFBGA package. Its JEDEC 5.0 compliance, flexible I/O and speed modes, and integrated data-management features make it suitable for embedded designs that require standardized, maintainable, and secure non-volatile storage.
This device is ideal for engineers and designers building systems that need bootable storage, partitioned/secure data areas, and robust operation across an extended temperature range. Features such as FFU, device health reporting, and ECC/block management contribute to long-term reliability and serviceability in deployed systems.
Request a quote or submit a quote for the MTFC64GAJAECE-AAT to discuss availability, lead times, and volume pricing for your next embedded storage design.
