MTFC64GAKAEEY-3M WT
| Part Description |
IC FLASH 512GBIT MMC 153LFBGA |
|---|---|
| Quantity | 488 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-LFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -25°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-LFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC64GAKAEEY-3M WT – IC FLASH 512Gbit e.MMC, 153-LFBGA
The MTFC64GAKAEEY-3M WT is a 512 Gbit (64 GByte) embedded MultiMediaCard (e.MMC) solution integrating NAND flash and an MMC controller in a 153-ball LFBGA package. It implements JEDEC/MMC standard version 5.0 features and on-device management to deliver a compact, ready-to-use embedded storage element.
Built for systems requiring high-density non-volatile storage with on-chip block management, secure partitions and multiple high-speed MMC bus modes, this device targets embedded designs that need compact integration, managed flash services and a commercial operating temperature range.
Key Features
- Core / Architecture Integrated MMC controller and NAND flash in a single e.MMC device, compliant with JEDEC/MMC standard version 5.0.
- Memory 512 Gbit (64 GByte) NAND Flash organized as 64G × 8 for high-density embedded storage.
- Interfaces & Performance Advanced 12-signal MMC interface supporting x1, x4 and x8 I/Os selectable by the host; SDR/DDR modes up to 52 MHz, and HS200/HS400 modes. Typical HS400 sequential read up to 280 MB/s and sequential write up to 50 MB/s for the 64GB device (datasheet values).
- Power VCC supply range 2.7–3.6 V; VCCQ dual-voltage option 1.65–1.95 V and 2.7–3.6 V (as documented in product datasheet).
- Reliability & Security On-device ECC and block management, reliable write, Replay-Protected Memory Block (RPMB), secure erase and secure trim, temporary/permanent write protection and hardware reset signal.
- System Features Boot operation (high-speed boot), multiple partitions with enhanced attributes, cache support, background operation, device health reporting and field firmware update (FFU).
- Package & Temperature 153-LFBGA package (11.5 × 13 mm) with operating temperature range –25 °C to +85 °C and storage temperature –40 °C to +85 °C.
- Compliance 153-ball FBGA is described in the datasheet as RoHS compliant ("green package").
Typical Applications
- Embedded systems Compact on-board storage for systems that require managed NAND flash and an MMC interface.
- Boot and system storage High-speed boot operation support enables use as primary boot and file-system storage in embedded platforms.
- Secure data storage RPMB and secure erase/trim features support protected partitions and secure data handling.
- Portable and handheld devices High-density storage in a small 153-LFBGA footprint for space-constrained, battery-powered designs operating within the device temperature range.
Unique Advantages
- High-density storage: 512 Gbit (64 GByte) capacity provides significant on-board non-volatile memory without external flash stacks.
- Standards-based MMC interface: JEDEC/MMC v5.0 compliance and selectable x1/x4/x8 I/O modes simplify host integration across MMC-capable platforms.
- High-speed bus modes: HS200/HS400 support and documented sequential throughput numbers enable higher-performance data paths where supported by the host.
- On-device data management: ECC, block management, reliable write and device health reporting reduce host firmware complexity for flash maintenance.
- Security and partitioning: RPMB, secure erase/trim and multiple partition support enable secure storage and controlled access for protected data areas.
- Compact, industrial-range package: 153-LFBGA (11.5 × 13 mm) with –25 °C to +85 °C operating range fits space- and temperature-constrained embedded designs.
Why Choose MTFC64GAKAEEY-3M WT?
The MTFC64GAKAEEY-3M WT delivers a high-density, standards-compliant e.MMC flash solution with integrated controller functions and on-device flash management. Its combination of HS200/HS400 bus modes, secure partitioning (RPMB) and field firmware update capability makes it suitable for designs that require compact, managed storage with higher performance options.
This device is appropriate for engineers specifying embedded storage where a single-package solution reduces BOM complexity, supports secure partitions, and operates across a broad commercial temperature range. Its feature set addresses long-term maintainability through health reporting and field firmware update mechanisms.
Request a quote or contact sales to obtain pricing, availability and technical ordering information for the MTFC64GAKAEEY-3M WT.