MTFC64GAKAEYF-4M IT TR

The MTFC64GAKAEYF-4M IT TR is a Micron e.MMC device combining a MultiMediaCard (MMC) controller with NAND flash memory in a 153-ball LFBGA package. It provides 512 Gbit organized as 64G × 8 and supports JEDEC/MMC standard version 5.0 features and high-speed bus modes.

Designed for embedded storage applications that require on-board flash with high-bandwidth interface options, the device delivers HS200/HS400 and SDR/DDR host modes, multiple security and partitioning features, and an industrial ambient operating range of –40°C to +85°C.

Key Features

• Core Architecture Integrated MultiMediaCard (MMC) controller and NAND flash provides a single-package e.MMC memory solution built to JEDEC/MMC standard version 5.0 (JESD84-B50).
• Memory and Organization 512 Gbit capacity organized as 64G × 8 (e.MMC memory format) to deliver large embedded storage in a compact footprint.
• Interface and Bus Modes Advanced 12-signal interface with selectable x1, x4, and x8 I/Os; supports SDR/DDR modes up to 52 MHz plus HS200 and HS400 high-speed operation.
• Performance (64GB device figures) HS400 sequential read up to 280 MB/s and sequential write up to 50 MB/s; random read and write performance up to thousands of IOPS (random read ~4,700 IOPS; random write up to ~5,800 IOPS with cache on).
• Power Supply VCC 2.7–3.6 V with dual VCCQ options of 1.65–1.95 V or 2.7–3.6 V, supporting flexible host voltage configurations.
• Security and Data Management Features include RPMB (replay-protected memory block), secure erase and secure trim, temporary and permanent write protection, reliable write, and ECC/block management.
• System and Maintenance Boot operation (high-speed boot), field firmware update (FFU), device health report, background operation, power-off notification, and hardware reset support.
• Package and Environment 153-ball LFBGA package (11.5 × 13 mm) offered as a RoHS-compliant "green package" with ambient operating temperature range of –40°C to +85°C.

Typical Applications

• Embedded storage for industrial systems High ambient-temperature rating (–40°C to +85°C), wide voltage support and robust partitioning/security features suit embedded storage in industrial equipment.
• Boot and system firmware storage High-speed boot capability and field firmware update (FFU) support enable reliable storage of boot loaders and firmware images.
• Consumer and mobile device storage HS200/HS400 high-bandwidth modes, selectable I/O widths, and large 512 Gbit capacity provide on-board mass storage for compact devices requiring fast sequential and random access.

Unique Advantages

• Integrated MMC controller and NAND Single-package integration simplifies host design by combining the controller and flash memory into an e.MMC device.
• JEDEC v5.0 compliance Compliance with the JEDEC/MMC standard (JESD84-B50) ensures standardized MMC operation and host interoperability.
• High-speed, flexible interfaces Support for x1/x4/x8 I/Os and multiple bus modes (SDR/DDR/HS200/HS400) enables designers to balance throughput and pin usage per system needs.
• Security and partitioning features RPMB, secure erase/trim, write protection, and multiple partitions with enhanced attributes support secure and managed data domains.
• Field serviceability and diagnostics Field firmware update (FFU) and device health reporting allow in-field maintenance and monitoring without board-level replacement.
• Industrial temperature capability Rated for –40°C to +85°C ambient operation to meet a wide range of environmental conditions.

Why Choose MTFC64GAKAEYF-4M IT TR?

The MTFC64GAKAEYF-4M IT TR positions itself as a compact, standards-compliant e.MMC storage solution that pairs Micron NAND with an integrated MMC controller to reduce system complexity. With HS200/HS400 support, selectable I/O widths, and documented 64GB performance figures for sequential and random access, it is suited to designs that require high-bandwidth embedded storage and secure partition management.

This device is appropriate for engineers designing embedded systems that need large on-board capacity, security features like RPMB and secure erase, and long-term serviceability through FFU and device health reporting. The industrial temperature rating and RoHS-compliant 153-LFBGA package provide a durable platform for deployed applications.

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