MTFC64GAKAEEY-4M IT

IC FLASH 512GBIT MMC 153LFBGA
Part Description

IC FLASH 512GBIT MMC 153LFBGA

Quantity 586 Available (as of May 4, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-LFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size512 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltageN/AMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-LFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization64G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC64GAKAEEY-4M IT – IC FLASH 512GBIT MMC 153LFBGA

The MTFC64GAKAEEY-4M IT is an e.MMC memory device that integrates a MultiMediaCard (MMC) controller with NAND flash to provide non-volatile, on-board storage. The device is organized as 64G × 8 (512 Gbit) and is supplied in a 153-ball LFBGA package.

Designed for embedded storage applications, the device supports JEDEC/MMC standard version 5.0 features and high-speed bus modes (including HS200 and HS400). Key value propositions include integrated MMC controller functionality, selectable I/O widths, and a wide ambient operating temperature range of –40°C to +85°C.

Key Features

  • Core Architecture Integrated MultiMediaCard (MMC) controller combined with NAND Flash for a single-package embedded storage solution.
  • Memory Organization & Capacity 64G × 8 organization yielding 512 Gbit of non-volatile FLASH memory.
  • Standards Compliance JEDEC/MMC standard version 5.0-compliant (JESD84-B50), supporting MMC-specific commands and features.
  • High-Speed Performance (64G device) HS400 sequential read up to 280 MB/s and sequential write up to 50 MB/s; random read up to 4,700 IOPS and random write (cache on) up to 5,800 IOPS as documented for the 64G variant.
  • Bus Modes & I/O Supports x1, x4 and x8 I/O (host-selectable), SDR/DDR modes up to 52 MHz, plus HS200 and HS400 operation.
  • Power Supply Ranges VCC: 2.7–3.6 V; VCCQ (dual-voltage options): 1.65–1.95 V and 2.7–3.6 V.
  • Security & Reliability Features include a replay-protected memory block (RPMB), secure erase/secure trim, temporary/permanent write protection, ECC and block management.
  • Operational Features Boot operation (high-speed boot), sleep mode, hardware reset, background operation, field firmware update (FFU), device health report, and power-off notification.
  • Package & Temperature 153-ball LFBGA package (11.5 × 13 mm) listed as a RoHS-compliant "green package"; ambient operating temperature range –40°C to +85°C.

Typical Applications

  • Boot Storage High-speed boot operation support makes the device suitable for systems that require boot-from-flash capability.
  • Secure Data Storage RPMB and secure-erase features enable secure credential and protected-data storage within embedded systems.
  • Embedded System Storage Non-volatile NAND with an MMC interface and up to 512 Gbit capacity for on-board storage in embedded designs.
  • Field Upgradable Devices Field firmware update (FFU) support and device health reporting help manage firmware deployment and maintenance.

Unique Advantages

  • Integrated Controller and NAND: Combines MMC controller and NAND Flash in one device to simplify host design and reduce system-level integration effort.
  • JEDEC 5.0 Compliance: Standardized MMC feature set and command classes improve interoperability with MMC-compliant hosts.
  • High-Speed Interface Options: HS200/HS400 modes and selectable x1/x4/x8 I/O widths enable flexible performance scaling to match system requirements.
  • Large On-Board Capacity: 512 Gbit (64G × 8) provides substantial local storage for data logging, multimedia, and application code.
  • Operational Robustness: Wide ambient operating range (–40°C to +85°C) and RoHS-compliant LFBGA packaging support deployment in temperature-challenging environments.
  • Security and Maintenance Features: RPMB, secure erase/trim, and FFU functionality support secure storage and field maintenance workflows.

Why Choose MTFC64GAKAEEY-4M IT?

The MTFC64GAKAEEY-4M IT positions itself as a compact, standards-based embedded storage solution that blends an integrated MMC controller with NAND flash in a 153-LFBGA package. Its documented HS400/HS200 performance modes, selectable I/O widths, and secure storage features make it suitable for system designs that need verified MMC functionality and substantial non-volatile capacity.

This device is well suited for designers and procurement teams targeting embedded systems requiring on-board, removable-free storage with field firmware update capability, secure partitioning (RPMB), and robust ambient temperature operation. The combination of standardized interface behavior and device-level management features supports long-term maintainability and system integration.

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