MTFC64GASAONS-AAT
| Part Description |
IC FLASH 512GBIT MMC 153TFBGA |
|---|---|
| Quantity | 162 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-TFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (SLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | 52 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TC) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | UFS2.1 | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Qualification | AEC-Q100 | ECCN | N/A | HTS Code | N/A |
Overview of MTFC64GASAONS-AAT – 512 Gbit UFS Automotive Flash (153‑TFBGA)
The MTFC64GASAONS-AAT is a 512 Gbit non-volatile NAND flash memory device integrating a UFS controller and NAND Flash in a 153‑TFBGA package. It implements UFS functionality (JEDEC/UFS v2.1 compliant, with selected v3.0 features) and is targeted for embedded applications requiring high-density, secure and reliable flash storage in demanding temperature environments.
Built for system boot, secure storage and high-speed background operations, the device delivers a compact packaged solution with automotive-grade qualification and extended temperature support for designs that require longevity and robustness.
Key Features
- Memory Core & Capacity — 512 Gbit NAND Flash organized as 64G × 8, implemented as SLC NAND technology for non-volatile storage.
- UFS Interface — JEDEC/UFS specification version 2.1-compliant with selected v3.0 features; supports advanced 6-signal interface, differential I/O pins and two-lane operation.
- Performance Modes — Supports Gear 1/2/3 operation and high-speed boot operation for fast system start and data transfers.
- Security & Data Management — Supports replay‑protected memory block (RPMB), permanent and power‑on write protection, command queuing, cache and FFU (firmware update) features.
- Reliability & Retention — AEC‑Q100 qualification and retention compliant per AEC‑Q100‑005: 5 years @ 55°C at 10% of PE and 1 year @ 55°C at maximum PE; MSL3 package handling.
- Power — Core supply VCC: 2.7–3.6 V (datasheet also specifies VCCQ2: 1.7–1.95 V); designed for typical embedded supply domains.
- Package & Thermal — 153‑TFBGA JEDEC package (11.5 mm × 13 mm × 1.2 mm) with a case operating temperature range of −40°C to +105°C (TC).
- Maintenance & Background Operations — Features background operation, REFRESH operation, reliable write, discard/erase and temperature event notification to support long-term data integrity.
- Standards & Certification — RoHS certification and AEC‑Q100 qualification noted in the product documentation.
Typical Applications
- Automotive Systems — High-density non‑volatile storage for in-vehicle systems, supporting high-speed boot and retention requirements specified for automotive use.
- Secure Boot & Key Storage — Use of RPMB and power-on write protection for secure boot images, credentials and protected data storage.
- Embedded Control & ECUs — Firmware and data storage for embedded controllers that require reliable flash across an extended temperature range and AEC‑Q100 qualification.
- High‑Performance Storage Subsystems — Applications requiring UFS protocol features such as command queuing, cache and FFU for efficient background operations and updates.
Unique Advantages
- Integrated UFS Controller and NAND — Combines controller and NAND in a single 153‑TFBGA package to reduce system integration complexity and BOM count.
- Automotive‑Grade Qualification — AEC‑Q100 qualification and retention data provide documented reliability metrics for long-term deployments in temperature-challenging environments.
- Secure Storage Features — RPMB and write protection options enable secure storage and boot strategies without external secure elements.
- Compact Package — 11.5 × 13 mm TFBGA package allows high-density storage in space-constrained embedded designs.
- Wide Supply Range — Operates from 2.7 V to 3.6 V (with VCCQ2 specified at 1.7–1.95 V in documentation), accommodating common automotive and embedded power rails.
Why Choose IC FLASH 512GBIT MMC 153TFBGA?
The MTFC64GASAONS-AAT positions itself as a high-density, automotive‑qualified UFS flash solution that balances integration, security and thermal robustness. Its combination of a UFS controller with SLC NAND, RPMB support, and AEC‑Q100 qualification makes it suitable for designs that require reliable boot media, protected data storage and long-term retention under elevated temperatures.
This device is appropriate for engineers and procurement teams designing embedded and automotive systems that need a compact, standards-compliant UFS storage element with documented retention and package handling characteristics.
If you would like pricing details, availability or to request a formal quote for MTFC64GASAONS-AAT, please submit a quote request or contact sales for assistance.