MTFC64GASAONS-AAT

IC FLASH 512GBIT MMC 153TFBGA
Part Description

IC FLASH 512GBIT MMC 153TFBGA

Quantity 162 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-TFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND (SLC)
Memory Size512 GbitAccess TimeN/AGradeAutomotive
Clock Frequency52 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 105°C (TC)Write Cycle Time Word PageN/APackaging153-TFBGA
Mounting MethodNon-VolatileMemory InterfaceUFS2.1Memory Organization64G x 8
Moisture Sensitivity LevelN/ARoHS ComplianceUnknownREACH ComplianceREACH Unaffected
QualificationAEC-Q100ECCNN/AHTS CodeN/A

Overview of MTFC64GASAONS-AAT – 512 Gbit UFS Automotive Flash (153‑TFBGA)

The MTFC64GASAONS-AAT is a 512 Gbit non-volatile NAND flash memory device integrating a UFS controller and NAND Flash in a 153‑TFBGA package. It implements UFS functionality (JEDEC/UFS v2.1 compliant, with selected v3.0 features) and is targeted for embedded applications requiring high-density, secure and reliable flash storage in demanding temperature environments.

Built for system boot, secure storage and high-speed background operations, the device delivers a compact packaged solution with automotive-grade qualification and extended temperature support for designs that require longevity and robustness.

Key Features

  • Memory Core & Capacity — 512 Gbit NAND Flash organized as 64G × 8, implemented as SLC NAND technology for non-volatile storage.
  • UFS Interface — JEDEC/UFS specification version 2.1-compliant with selected v3.0 features; supports advanced 6-signal interface, differential I/O pins and two-lane operation.
  • Performance Modes — Supports Gear 1/2/3 operation and high-speed boot operation for fast system start and data transfers.
  • Security & Data Management — Supports replay‑protected memory block (RPMB), permanent and power‑on write protection, command queuing, cache and FFU (firmware update) features.
  • Reliability & Retention — AEC‑Q100 qualification and retention compliant per AEC‑Q100‑005: 5 years @ 55°C at 10% of PE and 1 year @ 55°C at maximum PE; MSL3 package handling.
  • Power — Core supply VCC: 2.7–3.6 V (datasheet also specifies VCCQ2: 1.7–1.95 V); designed for typical embedded supply domains.
  • Package & Thermal — 153‑TFBGA JEDEC package (11.5 mm × 13 mm × 1.2 mm) with a case operating temperature range of −40°C to +105°C (TC).
  • Maintenance & Background Operations — Features background operation, REFRESH operation, reliable write, discard/erase and temperature event notification to support long-term data integrity.
  • Standards & Certification — RoHS certification and AEC‑Q100 qualification noted in the product documentation.

Typical Applications

  • Automotive Systems — High-density non‑volatile storage for in-vehicle systems, supporting high-speed boot and retention requirements specified for automotive use.
  • Secure Boot & Key Storage — Use of RPMB and power-on write protection for secure boot images, credentials and protected data storage.
  • Embedded Control & ECUs — Firmware and data storage for embedded controllers that require reliable flash across an extended temperature range and AEC‑Q100 qualification.
  • High‑Performance Storage Subsystems — Applications requiring UFS protocol features such as command queuing, cache and FFU for efficient background operations and updates.

Unique Advantages

  • Integrated UFS Controller and NAND — Combines controller and NAND in a single 153‑TFBGA package to reduce system integration complexity and BOM count.
  • Automotive‑Grade Qualification — AEC‑Q100 qualification and retention data provide documented reliability metrics for long-term deployments in temperature-challenging environments.
  • Secure Storage Features — RPMB and write protection options enable secure storage and boot strategies without external secure elements.
  • Compact Package — 11.5 × 13 mm TFBGA package allows high-density storage in space-constrained embedded designs.
  • Wide Supply Range — Operates from 2.7 V to 3.6 V (with VCCQ2 specified at 1.7–1.95 V in documentation), accommodating common automotive and embedded power rails.

Why Choose IC FLASH 512GBIT MMC 153TFBGA?

The MTFC64GASAONS-AAT positions itself as a high-density, automotive‑qualified UFS flash solution that balances integration, security and thermal robustness. Its combination of a UFS controller with SLC NAND, RPMB support, and AEC‑Q100 qualification makes it suitable for designs that require reliable boot media, protected data storage and long-term retention under elevated temperatures.

This device is appropriate for engineers and procurement teams designing embedded and automotive systems that need a compact, standards-compliant UFS storage element with documented retention and package handling characteristics.

If you would like pricing details, availability or to request a formal quote for MTFC64GASAONS-AAT, please submit a quote request or contact sales for assistance.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up