MTFC64GASAONS-AIT

IC FLASH 512GBIT MMC 153TFBGA
Part Description

IC FLASH 512GBIT MMC 153TFBGA

Quantity 1,048 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-TFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND (SLC)
Memory Size512 GbitAccess TimeN/AGradeAutomotive
Clock Frequency52 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 95°C (TC)Write Cycle Time Word PageN/APackaging153-TFBGA
Mounting MethodNon-VolatileMemory InterfaceUFS2.1Memory Organization64G x 8
Moisture Sensitivity LevelN/ARoHS ComplianceN/AREACH ComplianceREACH Unaffected
QualificationAEC-Q104ECCNN/AHTS CodeN/A

Overview of MTFC64GASAONS-AIT – IC FLASH 512Gbit UFS 2.1, 153-TFBGA

The MTFC64GASAONS-AIT is a 512 Gbit non-volatile NAND flash memory device implementing a Universal Flash Storage (UFS) architecture. It combines a UFS 2.1-compliant controller and NAND flash to deliver high-speed embedded storage targeted at automotive-grade applications and other systems requiring robust, persistent storage.

Designed for integration in constrained-board designs, the device provides high-speed transfer modes, power management features and functional-safety focused options to support boot, secure and background storage operations in demanding environments.

Key Features

  • Memory Core  512 Gbit NAND flash organized as 64G × 8, SLC NAND technology.
  • UFS Interface  JEDEC/UFS specification version 2.1-compliant interface with support for 2 lanes, differential I/O pins and advanced 6-signal interface; high-speed operation with Gear 1/2/3 supported.
  • Power and I/O Supply  Primary supply VCC: 2.7–3.6 V and VCCQ2: 1.7–1.95 V for I/O domain control.
  • Performance and Boot  Supports high-speed boot operation and command queuing for efficient system start-up and data throughput.
  • Security and Data Protection  Permanent and power-on write protection plus Replay-Protected Memory Block (RPMB) support for secure storage partitions.
  • Reliability and Maintenance  Background operation, reliable write, discard/erase and refresh operations; retention per AEC-Q100-005: 5 years @55°C at 10% PE and 1 year @55°C at maximum PE.
  • Functional Safety and Qualification  AEC-Q104 qualification and options for automotive and functional-safety documentation including FMEDA and Safety Application Notes (contact vendor for functional-safety documents).
  • Package and Temperature  153-ball JEDEC TFBGA package (11.5 mm × 13 mm); operating temperature range from –40°C to +95°C (TOPER is case surface temperature on the center/top of the package).
  • Form Factor and Mounting  153-TFBGA, surface-mount package suitable for board-level embedded storage integration; available in tray and tape-and-reel shipping forms.

Typical Applications

  • Automotive embedded storage  Persistent high-speed storage for automotive systems where AEC-Q104 qualification and extended temperature operation are required.
  • Boot and system firmware storage  High-speed boot support and reliable write features make it suitable for storing bootloaders and critical firmware.
  • Secure data partitions  Replay-protected memory block (RPMB) support provides a secure area for keys, counters and protected credentials.
  • Systems requiring long-term retention  Retention characterization per AEC-Q100-005 supports designs that require documented retention behavior at elevated temperatures.

Unique Advantages

  • Automotive-qualified storage: AEC-Q104 qualification and automotive-grade options provide documented suitability for automotive system design.
  • JEDEC-compliant UFS interface: UFS 2.1 compliance with multi-lane differential I/O and Gear 1/2/3 support enables standardized high-speed integration.
  • Secure partition support: RPMB and write-protection features enable secure storage use cases without additional external components.
  • Robust thermal envelope: Specified –40°C to +95°C case operating range (TOPER defined at package center/top) for reliable operation across demanding environments.
  • Retention and reliability data: Retention metrics provided (AEC-Q100-005) assist in system-level reliability planning and validation.
  • Compact BGA package: 153-ball TFBGA (11.5 mm × 13 mm) delivers dense embedded storage in space-constrained board layouts.

Why Choose MTFC64GASAONS-AIT?

The MTFC64GASAONS-AIT positions itself as a compact, automotive-focused embedded UFS storage solution that combines a JEDEC-compliant UFS controller with SLC NAND flash. Its qualification, retention data and secure partition features make it appropriate for designs that require deterministic behavior, secure storage areas and extended temperature operation.

This device is suited for engineering teams developing automotive and other high-reliability embedded systems that need standardized high-speed storage, documented retention characteristics and package options compatible with automated assembly.

If you would like pricing, availability or a formal quote for MTFC64GASAONS-AIT, request a quote or submit an inquiry and our team will assist with technical and procurement details.

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