MTFC64GASAONS-IT

IC FLASH 512GBIT UFS2.1 153TFBGA
Part Description

IC FLASH 512GBIT UFS2.1 153TFBGA

Quantity 295 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-TFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size512 GbitAccess TimeN/AGradeAutomotive
Clock Frequency52 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 95°C (TC)Write Cycle Time Word PageN/APackaging153-TFBGA
Mounting MethodNon-VolatileMemory InterfaceUFS2.1Memory Organization64G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC64GASAONS-IT – IC FLASH 512GBIT UFS2.1 153TFBGA

The MTFC64GASAONS-IT is a 512 Gbit non-volatile NAND flash memory module implemented as a UFS v2.1 device in a 153-ball TFBGA package. It integrates a UFS controller with NAND Flash to provide high-density embedded storage for industrial and embedded designs.

Designed for systems requiring compact, high-density storage, the device supports high-speed UFS signaling, secure replay-protected memory (RPMB), and power-on/ permanent write protection, delivering reliable boot and data-storage functions across a wide operating temperature and voltage range.

Key Features

  • Core  Universal Flash Storage (UFS) controller integrated with NAND Flash; JEDEC/UFS specification version 2.1-compliant with select UFS v3.0 features noted in the datasheet.
  • Memory  64G × 8 organization totaling 512 Gbit of NAND flash in a high-density footprint.
  • Interface  UFS 2.1 interface with an advanced 6-signal implementation, differential I/O pins and support for two lanes and Gear 1/2/3 operation for high-speed transfers.
  • Power  VCC supply range of 2.7 V to 3.6 V (datasheet also references VCCQ2 1.7 V–1.95 V); designed for typical UFS power domains and low-power states including sleep mode and background operation.
  • Security & Data Integrity  Replay-Protected Memory Block (RPMB), permanent and power-on write protection, reliable write, discard/erase, and command queuing for managed data integrity and secure storage use cases.
  • Boot & Maintenance  Supports high-speed boot operation and background/refresh operations to assist system boot and maintenance workflows.
  • Package & Temperature  153-TFBGA package (11.5 mm × 13 mm × 1.2 mm); industrial operating case temperature range from –40°C to +95°C.
  • Compliance & Handling  JEDEC/UFS 2.1 compliance and RoHS package compliance; supplied in tray or tape-and-reel shipping forms with BGA MSL3 handling considerations indicated in the datasheet.
  • Clock  Specified clock frequency: 52 MHz (device specification list).

Typical Applications

  • Industrial Systems  High-density embedded storage for industrial equipment that requires wide temperature operation and compact package integration.
  • Embedded Boot Storage  Use as high-speed boot and system storage leveraging the device’s high-speed boot support and UFS interface.
  • Secure Data Storage  Storage of authentication, firmware, and secure keys using the RPMB feature and write-protection mechanisms.
  • Compact High-Density Storage Modules  Designs needing 512 Gbit NAND capacity in a 153-ball TFBGA footprint for space-constrained boards.

Unique Advantages

  • Standards-based interface: UFS v2.1 JEDEC compliance provides a common, high-speed interface for system integration.
  • High capacity in a small footprint: 512 Gbit (64G × 8) NAND delivered in a 153-TFBGA 11.5 mm × 13 mm package reduces board area for high-density designs.
  • Industrial temperature support: –40°C to +95°C operating range supports deployment in harsh or wide-temperature environments.
  • Security and protection features: RPMB plus permanent and power-on write protection enable secure storage and controlled write access.
  • Flexible performance modes: Two-lane differential signaling and Gear 1/2/3 support enable scalable performance choices for different system requirements.
  • Controlled supply domains: Wide VCC range (2.7 V–3.6 V) and documented VCCQ2 support provide compatibility with common system power rails.

Why Choose IC FLASH 512GBIT UFS2.1 153TFBGA?

The MTFC64GASAONS-IT positions as a compact, high-capacity UFS storage solution for industrial and embedded applications that require secure, managed NAND storage with wide temperature tolerance. Its integrated UFS controller and NAND Flash in a 153-ball TFBGA package simplify board-level integration while offering UFS v2.1 feature support and advanced interface options.

This device is suited for designers seeking a scalable, standards-based storage element that combines density, security features (RPMB and write protection), and industrial temperature operation to support robust, long-term deployments and system boot/storage functions.

Request a quote or submit an inquiry for pricing and availability to evaluate the MTFC64GASAONS-IT for your design needs.

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