MTFC64GASAQHD-AAT TR
| Part Description |
IC FLASH 512GBIT EMMC 153VFBGA |
|---|---|
| Quantity | 832 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-VFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (SLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | 200 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-VFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC_5.1 | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Qualification | AEC-Q100 | ECCN | N/A | HTS Code | N/A |
Overview of MTFC64GASAQHD-AAT TR – IC FLASH 512GBIT EMMC 153VFBGA
The MTFC64GASAQHD-AAT TR is a 512 Gbit non-volatile NAND flash memory in an e.MMC form factor that integrates a MultiMediaCard controller and NAND flash. It implements JEDEC e.MMC 5.1 functionality with an advanced 12-signal interface and supports host-selectable ×1, ×4, and ×8 I/Os for compact embedded storage.
Designed for automotive-grade use, the device provides high-speed e.MMC connectivity (up to 200 MHz), field firmware update capability and features for secure and reliable on-board storage across a wide temperature range.
Key Features
- Memory Core 512 Gbit capacity organized as 64G × 8 using NAND flash (SLC technology).
- e.MMC 5.1 Interface JEDEC/MMC standard version 5.1-compliant with an advanced 12-signal interface; host-selectable ×1, ×4, ×8 I/Os and support for HS200/HS400 modes.
- Performance e.MMC interface boot frequency 0–52 MHz and I/F clock frequency 0–200 MHz for high-speed data transfer.
- Power VCC supply range 2.7 V to 3.6 V; VCCQ 1.70 V to 1.95 V (as specified in device documentation).
- Reliability & Data Management Built-in ECC and block management, command queue, reliable write, temporary/permanent write protection, discard and sanitize, and device health reporting.
- Security & Boot Boot operation (high-speed boot), Replay-Protected Memory Block (RPMB), high-priority interrupt (HPI), and hardware reset support.
- Maintenance & Safety Features Field firmware update (FFU), BKOPS control, power-off notification, thermal protection, and background operation support.
- Package & Temperature 153-ball VFBGA package (11.5 mm × 13 mm; 0.9 mm typical thickness) and rated operating temperature from −40 °C to +105 °C (TA).
- Automotive Qualification Grade: Automotive; Qualification: AEC-Q100; documentation references include automotive functional-safety-related information.
Typical Applications
- Automotive systems On-board non-volatile storage for automotive designs requiring AEC-Q100 qualification and extended temperature operation.
- System boot and firmware storage High-speed boot operation and field firmware update support for embedded system boot partitions and firmware images.
- Secure data and logging Replay-protected memory block (RPMB), reliable write and device health reporting for secure storage and diagnostic logging.
Unique Advantages
- Highly integrated e.MMC solution: Combines MMC controller and NAND flash in a single device to simplify board-level integration and system architecture.
- Automotive-grade robustness: AEC-Q100 qualification and an extended operating range of −40 °C to +105 °C for deployment in demanding environments.
- Flexible, high-speed interface: JEDEC e.MMC 5.1 compliance with selectable I/O widths and up to 200 MHz clock to support varied host performance requirements.
- Comprehensive data-management features: ECC, block management, command queue, reliable write, sanitize and discard functions improve data integrity and lifecycle management.
- Operational safety and maintenance: Field firmware update, thermal protection, BKOPS control, and power-off notification enable safer updates and background maintenance.
- Compact package: 153-ball VFBGA (11.5 × 13 mm) provides a dense footprint for space-constrained designs.
Why Choose MTFC64GASAQHD-AAT TR?
The MTFC64GASAQHD-AAT TR positions itself as a reliable, automotive-grade e.MMC storage component that combines integrated controller functionality with 512 Gbit NAND capacity. Its JEDEC 5.1 compliance, high-speed interface options, and comprehensive data-management and security features make it suitable for embedded applications that require robust on-board storage, secure boot and firmware update capabilities.
Engineers and procurement teams designing systems for automotive and other temperature-demanding environments will find the device offers a balance of integration, manageability and qualification-driven reliability, backed by functional-safety-related documentation in the product literature.
Request a quote or submit an RFQ for MTFC64GASAQHD-AAT TR to initiate a procurement inquiry or to obtain pricing and availability information.
