MTFC64GASAQHD-AIT TR
| Part Description |
IC FLASH 512GBIT EMMC 153VFBGA |
|---|---|
| Quantity | 189 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-VFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (SLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | 200 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-VFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC_5.1 | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | N/A | REACH Compliance | REACH Unaffected | ||
| Qualification | AEC-Q104 | ECCN | N/A | HTS Code | N/A |
Overview of MTFC64GASAQHD-AIT TR – 512Gbit e.MMC (153-VFBGA, Automotive AEC-Q104)
The MTFC64GASAQHD-AIT TR is a 512 Gbit non-volatile NAND flash memory device with an integrated MultiMediaCard controller, delivered in a 153-ball VFBGA package. It implements e.MMC functionality and is JEDEC/MMC standard version 5.1-compliant.
Targeted at automotive-grade storage applications, the device provides a high-speed e.MMC interface (up to 200 MHz), boot support, and a suite of data-management and safety features suitable for systems requiring robust on-board flash and functional-safety capabilities.
Key Features
- Memory 512 Gbit FLASH NAND (SLC) organized as 64G × 8; non-volatile e.MMC storage.
- Interface & Performance JEDEC e.MMC 5.1-compliant with an advanced 12-signal interface; selectable ×1, ×4, and ×8 I/Os; e.MMC I/F clock frequency up to 200 MHz and e.MMC boot frequency up to 52 MHz; HS200/HS400 mode supported.
- Power VCC range 2.7–3.6V and VCCQ range 1.70–1.95V for core and I/O power.
- Reliability & Functional Safety Qualified to AEC-Q104 and described with automotive and functional safety capabilities (Automotive SPICE Level 3, PPAP, FMEDA references noted in documentation).
- Data Management & Security Features include command queue, BKOPS control, temporary and power-on write protection, boot operation (high-speed boot), replay-protected memory block (RPMB), reliable write, discard and sanitize, permanent write protection, device health report, and field firmware update (FFU).
- System Integration Includes ECC and block management, high-priority interrupt (HPI), data strobe pin, hardware reset signal, multiple partitions with enhanced attributes, and background operation support.
- Package & Temperature 153-ball VFBGA (11.5 × 13 mm) package; operating temperature range −40°C to +85°C (TA) for the AIT grade.
Typical Applications
- Automotive boot storage High-speed boot operation and e.MMC boot support enable use as primary boot and firmware storage in automotive electronic control units.
- Secure data storage Replay-protected memory block (RPMB) plus write-protection features support secure storage of credentials, logs, and authenticated data.
- High-throughput media and logging HS200/HS400 modes and up to 200 MHz interface clock provide the bandwidth needed for multimedia storage and high-rate data logging.
Unique Advantages
- Automotive-grade qualification: AEC-Q104 qualification and documented functional-safety references (Automotive SPICE Level 3, FMEDA, PPAP) support integration into automotive programs.
- Standards-based e.MMC 5.1 interface: JEDEC compliance and selectable I/O widths simplify host integration and interoperability with standard e.MMC hosts.
- High interface bandwidth: Up to 200 MHz e.MMC clock and HS200/HS400 support enable high-throughput storage and low-latency boot.
- Comprehensive data management: Built-in ECC, command queue, reliable write, device health reporting, and background operations reduce firmware complexity and improve data integrity.
- Compact, high-density package: 512 Gbit capacity in a 153-ball VFBGA (11.5 × 13 mm) package conserves board area while providing large on-board storage.
- Wide voltage and temperature operating range: 2.7–3.6V (VCC), 1.70–1.95V (VCCQ), and −40°C to +85°C operating range for application flexibility.
Why Choose IC FLASH 512GBIT EMMC 153VFBGA?
The MTFC64GASAQHD-AIT TR combines high-density NAND flash with an integrated e.MMC controller and a broad set of data-management and safety features, making it appropriate for automotive-grade storage designs that require JEDEC-compliant e.MMC functionality and high interface bandwidth. Its qualification to AEC-Q104 and documented functional-safety support align with automotive program requirements.
This device is suited for designers seeking a compact, standards-based on-board storage solution that offers secure storage, boot capability, and extensive reliability features while minimizing board footprint and integration effort.
Request a quote or contact sales to discuss availability, pricing, lead times, and technical details for MTFC64GASAQHD-AIT TR.
