MTFC64GASAQHD-AAT

IC FLASH 512GBIT EMMC 153VFBGA
Part Description

IC FLASH 512GBIT EMMC 153VFBGA

Quantity 319 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-VFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND (SLC)
Memory Size512 GbitAccess TimeN/AGradeAutomotive
Clock Frequency200 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 105°C (TA)Write Cycle Time Word PageN/APackaging153-VFBGA
Mounting MethodNon-VolatileMemory InterfaceeMMC_5.1Memory Organization64G x 8
Moisture Sensitivity LevelN/ARoHS ComplianceUnknownREACH ComplianceREACH Unaffected
QualificationAEC-Q100ECCNN/AHTS CodeN/A

Overview of MTFC64GASAQHD-AAT – IC FLASH 512GBIT EMMC 153VFBGA

The MTFC64GASAQHD-AAT is a 512 Gbit non-volatile e.MMC storage device implementing NAND flash (SLC) in a 153-ball VFBGA package. It integrates a MultiMediaCard controller with NAND flash and implements the JEDEC/MMC standard version 5.1 interface for embedded storage.

Designed for automotive-grade applications, this device supports high-speed boot, secure and partitioned storage, and on-die management features to address system boot, firmware storage, large-capacity data logging, and secure key/credential storage within constrained board space.

Key Features

  • Memory Type & Capacity — 512 Gbit NAND flash (SLC) organized as 64G × 8, providing large onboard non-volatile storage.
  • e.MMC 5.1 Interface — JEDEC/MMC Standard No. JESD84-B51-compliant e.MMC 5.1 interface with support for command queue, multiple partitions, and RPMB (Replay-Protected Memory Block).
  • High-Speed I/O Options — Advanced 12-signal interface with selectable ×1, ×4, and ×8 I/Os; e.MMC I/F clock frequency up to 200 MHz and boot frequency 0–52 MHz; supports HS200/HS400 modes.
  • Power Supply — VCC supply range 2.7 V to 3.6 V; VCCQ supply 1.70 V to 1.95 V.
  • System and Data Protection — Built-in ECC and block management, reliable write, temporary and permanent write protection, discard and sanitize, power-off notification, and thermal protection.
  • Functional & Safety Features — Hardware reset, high-priority interrupt (HPI), field firmware update (FFU), device health report, and background operation support as described in device documentation.
  • Automotive Qualification & Temperature Range — AEC-Q100 qualification and specified operating temperature from −40°C to +105°C (TA).
  • Package — 153-ball VFBGA package, supplier device package specified as 153-VFBGA (11.5 × 13 mm).

Typical Applications

  • Automotive Infotainment and Telematics — High-capacity local storage for multimedia, map data, and application firmware where robust boot and partitioning features are required.
  • System Boot and Firmware Storage — High-speed boot operation and reliable write features support firmware image storage and fast system startup.
  • Secure Storage — RPMB and write-protection features enable secure credential and configuration storage for safety-critical functions.
  • Data Logging and Event Recording — Large onboard capacity and background operation make the device suitable for long-term data logging and event storage in embedded systems.

Unique Advantages

  • Automotive-Grade Qualification: AEC-Q100 qualification and an extended operating range of −40°C to +105°C support deployment in automotive environments.
  • Standards-Based Integration: JEDEC/MMC 5.1 compliance and support for HS200/HS400 modes enable straightforward integration with e.MMC hosts implementing the same standard.
  • Flexible Performance Scaling: Selectable ×1/×4/×8 I/Os and up to 200 MHz clocking allow designers to balance throughput and signal/pin constraints.
  • Integrated Data Management: On-die ECC, block management, reliable write, and power-off notification reduce host software complexity for data integrity and recovery.
  • Secure and Partitioned Storage: RPMB, multiple enhanced partitions, and write-protection mechanisms provide segregated secure storage and controlled access.
  • Compact, High-Density Package: 153-ball VFBGA (11.5 × 13 mm) provides high capacity in a compact footprint suitable for space-constrained PCBs.

Why Choose MTFC64GASAQHD-AAT?

The MTFC64GASAQHD-AAT combines high-capacity 512 Gbit NAND flash with an e.MMC 5.1-compliant controller and automotive-grade qualification to deliver an integrated storage solution for embedded and automotive systems. Its combination of high-speed I/O options, secure storage primitives (RPMB, write protection), and integrated data management features simplifies host design while addressing reliability and safety considerations.

This device is suited to designs that require durable, high-density onboard storage with automotive operating range and qualification, including systems that need secure boot, firmware update capability, and robust data integrity mechanisms. The compact 153-VFBGA package supports integration into space-constrained boards without sacrificing capacity.

Request a quote or submit an inquiry to discuss availability, lead times, and pricing for the MTFC64GASAQHD-AAT.

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